2015
DOI: 10.1039/c5cc05272f
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Low temperature deposition of 2D WS2 layers from WF6 and H2S precursors: impact of reducing agents

Abstract: We demonstrate the impact of reducing agents for Chemical Vapor Deposition (CVD) and Atomic Layer Deposition (ALD) of WS2 from WF6 and H2S precursors. Nanocrystalline WS2 layers with a two-dimensional structure can be obtained at low deposition temperatures (300-450 °C) without using a template or anneal.

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Cited by 74 publications
(79 citation statements)
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“…The H2 plasma reaction enables the reduction of -W 6+ Fx surface species, but needs to be mild (100 W, 10 s) to avoid sub-surface reduction of the WS2 layers. For detailed description of the PEALD reaction cycle and deposition conditions, the reader is referred to earlier published work 23,24 .…”
Section: Methodsmentioning
confidence: 99%
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“…The H2 plasma reaction enables the reduction of -W 6+ Fx surface species, but needs to be mild (100 W, 10 s) to avoid sub-surface reduction of the WS2 layers. For detailed description of the PEALD reaction cycle and deposition conditions, the reader is referred to earlier published work 23,24 .…”
Section: Methodsmentioning
confidence: 99%
“…Growth enhancement is not common in ALD processes 23 . It has been attributed to either the topography of the starting substrate, resulting in increased surface area, and/or to an increased reactivity and/or density of reactive sites at the starting surface 39 .…”
Section: A Substrate Enhanced Growth Of Ws2 Peald On Amorphous Al2o3mentioning
confidence: 99%
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“…However, synthesis of large area, high quality TMD films using industry-compatible processes remains a major challenge and requires the development of highly controllable growth processes. Large area TMD layers can be grown using various techniques including chemical vapor deposition (CVD), [4][5][6] atomic layer deposition (ALD) 7 and molecular beam epitaxy (MBE) processes. 8 An interesting low cost approach that is capable of providing large-area sheets of TMDs with controllable thicknesses is chalcogenidation of ultrathin transition metal films.…”
mentioning
confidence: 99%