Low-Temperature Metal^|^#8211;Metal Bonding Process Using Leaf-Like Aggregates Composed of CuO Nanoparticles

Maeda, Takafumi; Kobayashi, Yoshio; Yasuda, Yusuke; Morita, Toshiaki

doi:10.1252/jcej.14we134

Cited by 4 publications

(1 citation statement)

References 25 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The bonding property of the fabricated nanoparticles was investigated with the same set-up as used in our previous works (Yasuda et al 2009;Kobayashi et al 2011;Maeda et al 2015). The powder samples, obtained in the same procedure as used for the XRD measurements, were sandwiched between a large copper disc (diameter: 10 mm; thickness: 5 mm) and a small disc (diameter: 5 mm; thickness: 2.5 mm) and pressed under annealing at 400°C in hydrogen gas or nitrogen gas at 1.2 MPa for 5 min with a Shinko Seiki vacuum reflow system.…”

Section: Characterizationmentioning

confidence: 99%

Metal–metal bonding using silver/copper nanoparticles

et al. 2015

View full text Add to dashboard Cite

A method for producing nanoparticles composed of silver and copper and a metal-metal bonding technique using the silver/copper nanoparticles are proposed. The method consists of three steps. First, copper oxide nanoparticles are produced by mixing Cu(NO 3 ) 2 aqueous solution and NaOH aqueous solution. Second, copper metal nanoparticles are fabricated by reducing the copper oxide nanoparticles with hydrazine in the presence of poly(vinylpyrrolidone) (PVP). Third, silver/copper nanoparticles are synthesized by reducing Ag ? ions with hydrazine in the presence of the copper metal nanoparticles. Initial concentrations in the final silver/copper particle colloid, composed of 0.0075 M Cu 2? , 0.0025 M Ag ? , 1.0 g/L PVP, and 0.6 M hydrazine, produced silver/copper nanoparticles with an average size of 49 nm and a crystal size of 16.8 nm. Discs of copper metal were successfully bonded by the silver/copper nanoparticles under annealing at 400°C and pressurizing at 1.2 MPa for 5 min in not only hydrogen gas but also nitrogen gas. The shear force required to separate the bonded discs was 22.3 MPa for the hydrogen gas annealing and 14.9 MPa for the nitrogen gas annealing (namely, 66.8 % of that for hydrogen gas annealing).

show abstract

Section: Characterizationmentioning

confidence: 99%