Low temperature metal-metal bonding for heterogeneous integration and performance scaling

Goorsky, Mark S.; Schjølberg-Henriksen, Kari; Beekley, Brett; Marathe, Niteesh; Mani, Karthick; Bajwa, Adeel; Iyer, Subramanian S.

doi:10.23919/ltb-3d.2017.7947438

Cited by 1 publication

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“…It was found that the dicing yield was 100% for the samples bonded at all temperatures, showing that the areas that did bond provided a seal which was strong enough to withstand the force exerted by the wafer dicer. 25) The results in the current study show that for all samples, at least 50% of the frame area appears to be bonded. This bonded area is likely to account for the high dicing yield.…”

Section: Discussionmentioning

confidence: 52%

“…In particular, the role of the initial surface morphology and roughness on the formation of interfacial voids is addressed, as is the difference in the void characteristics after bonding over this low temperature range. A prior conference proceedings extended abstract 25) only touched on these issues; this work reports much more extensive data and analysis.…”

Section: Introductionmentioning

confidence: 99%

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Characterization of interfacial morphology of low temperature, low pressure Au–Au thermocompression bonding

Goorsky

Schjølberg-Henriksen

Beekley

et al. 2017

Jpn. J. Appl. Phys.

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Au–Au thermocompression bonding is a versatile technique of high interest for a variety of applications. We have investigated Au–Au bonding using sputter deposited Au films under conditions of low temperature (150–250 °C) and low bonding pressure (∼3 MPa) for short times (15 min). The combination of low temperature and short times is important for applications involving both hermetic sealing and packaging scaling. The initial surface roughness of the Au film was in the 3–5 nm range with peak-to-valley heights of 20–30 nm and a lateral correlation length of ∼400 nm. For samples bonded at 150 °C, the void morphology at the bonded interface was related to the initial surface roughness. The void morphology was different when bonding at the higher temperatures: the void length (along the bonded interface) decreased significantly but the void height (perpendicular to the interface) increased. These results can be understood in terms of a combination of increased surface Au diffusivity and decreased yield stress and elastic modulus with increased bonding temperature.

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Section: Discussionmentioning

confidence: 52%

Section: Introductionmentioning

confidence: 99%