Low temperature nanoparticle sintering with continuous wave and pulse lasers

Kumpulainen, Tero; Pekkanen, Jussi; Valkama, Jani; Laakso, Jarmo; Tuokko, Reijo; Mäntysalo, Matti

doi:10.1016/j.optlastec.2010.08.002

Cited by 99 publications

(62 citation statements)

References 16 publications

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“…1−6 The conductive metal nanoparticle inks based on Au, Ag, and Cu nanoparticles have been conventionally used for printed metallization, and their sintering mechanism during thermal heating has been well-understood. 7,8 In addition, various advanced sintering techniques, such as electrical, 9 microwave, 10 plasma, 11 laser, 12 flash light [intense pulsed light (IPL)], 13 and chemical sintering, 14,15 have been developed for the efficient densification and high electrical conductivity of the printed films with such metal nanoparticle inks. Recently, the solutionbased inks including a metal ion complex ink and a metal− organic decomposition (MOD) ink have been studied to overcome the limitations of the nanoparticle-based inks (i.e., the difficulty of their stability, scalabilily, and cost reduction).…”

Section: Introductionmentioning

confidence: 99%

Effect of the Amine Concentration on Phase Evolution and Densification in Printed Films Using Cu(II) Complex Ink

Choi

Hong

2015

Langmuir

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The nucleation and growth behavior of Cu nanoparticles during thermal heating of Cu(II) complex inks for printed Cu metallization were investigated, particularly focusing on the effects of the amine concentration on the microstructure evolution and electrical conductivity. Herein, the dual effects of hexylamine as a reducing agent dissociating the carboxyl group from the precursor and a capping agent hindering the subsequent growth of Cu nuclei were confirmed. On the basis of such dual effects of amine, the sufficient complexation of the Cu(II) precursor with a high amine concentration in the ink led to the single-route growth of Cu nanoparticles during thermal heating, which resulted in the dense film with a narrow particle size distribution exhibiting a high electrical conductivity. The electrical conductivity of the film could be further enhanced by a reducing atmosphere with formic acid. Significantly, the understanding of the ink chemistry and the nucleation and growth kinetics in the metal ion complex or metal-organic decomposition (MOD) ink can provide the design rules for the formulation of the solution-type inks to control the microstructure of printed metallization.

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Section: Introductionmentioning

confidence: 99%

Effect of the Amine Concentration on Phase Evolution and Densification in Printed Films Using Cu(II) Complex Ink

Choi

Hong

2015

Langmuir

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“…The main drawback of pulsed lasers compared to CW lasers is the pulse repetition rate. Individual pulses have to overlap each other in order to obtain continuous sintered patterns, and as a result the maximum sintering speed is limited (90). For low pulse overlap, the pattern may have parts that are not sintered or are partially sintered.…”

Section: Postprinting Processes To Form Conductive Contacts and Intermentioning

confidence: 99%

Direct Laser Printing for Organic Electronics

Makrygianni

Papazoglou

Zergioti

2015

Wiley Encyclopedia of Electrical and Electronics Engineering

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This article reviews the latest developments as well as the background and the evolution of direct laser printing of various materials for organic electronics applications. Current technological trends require the precise deposition of highly resolved features, which preserve their structural and electronic properties upon transfer, while increasing the number of components that can be integrated in a single device. Direct laser printing techniques meet these requirements and examples of selected applications, including chemical sensors and biosensors, organic thin‐film transistors, organic light‐emitting diodes, and power generating devices, are presented highlighting the potential incorporation of lasers into the direct printing of entire devices and components. In particular, the successful laser printing of polymers, metals, semiconducting inks, and viable biological materials such as DNA, proteins, and enzymes with high spatial resolution offers unique advantages compared to traditional inkjet and thin‐film techniques. Moreover, the mechanisms of liquid‐ and solid‐phase laser printing are investigated through time‐resolved studies, while postprinting processes such as laser sintering, a process used for the formation of conductive features on laser‐printed metallic nanoparticle patterns, are also discussed in this article.

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“…This, however, is too high for smart package applications. Various alternative sintering methods, such as laser sintering [16], pulsed light [17], electrical sintering [18], microwave [19], and plasma [20] have recently been introduced. Despite promising results though, none of these methods can yet challenge heat annealing.…”

Section: Optimizing Nano-particle Annealing Temperaturementioning

confidence: 99%

System integration of smart packages using printed electronics

Mäntysalo

Xie

Jönsson

et al. 2012

2012 IEEE 62nd Electronic Components and Technology Conference

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The last decade has shown enormous interest in additive and printed electronics manufacturing technologies, especially in intelligent packaging. Scientists and engineers all over the world are developing printed organic circuits. Despite their effort, the performance and yield of all-printed devices cannot replace silicon-based devices in smart package applications. Therefore, we have developed a hybrid interconnection platform to seamlessly integrate printed electronics with silicon-based electronics, close the gap between the two technologies, and to anticipate adaption of printed electronic technologies. We studied the suitability of a printed interconnection platform by fabricating a printed sensor-box that contains printed nano-Ag-interconnections on lowtemperature plastic, a printable humidity sensor based on functionalized MWCNTs, a printed battery, conventional SMDs, and a silicon-based MCU. IntroductionDevelopments in microelectronics and communication technologies will soon enable embedded smart-device networks. Such devices sense their environment, process data, and exchange information by forming spontaneous networks. This is the vision of the Internet-of-Things (IoT), which will entail a revolution in service creation and availability and change the way we interact [1,2]. Promising technologies enabling the IoT include radio frequency identification (RFID) [3], near field communication (NFC) [2, 3], global positioning system (GPS), and ultra-wide band (UWB) communication [4]. They enable unique and secure identification of physical objects, including the possibility to measure, manage, process, and change data in real time. For example, smart tags or labels with temperature, humidity, and gas sensors can measure storage and transportation conditions of goods and thus help improve supply chain management.The above vision together with manufacturability, costefficiency, and sustainable development has encouraged scientist and engineers to look for new alternative methods to manufacture electronics. One alternative is printed electronics, a revolutionary approach to enable cost-effective manufacturing [5]. A small amount of functional ink is directly and accurately printed on a substrate, for example, by inkjet, screen, flexography, offset, or gravure. The inks may contain, for example, conductive organic compounds, inorganic metal nano-particles, semiconductive materials, dielectric polymers, or metal oxides. Recent developments in nanotechnology have produced inorganic nanoparticle, carbon nanotube (CNT), and graphene inks, which have enabled fabrication of transparent conductive thin-film structures [6,7], sensor elements [8], and transistors [9,10].

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Low temperature nanoparticle sintering with continuous wave and pulse lasers

Cited by 99 publications

References 16 publications

Effect of the Amine Concentration on Phase Evolution and Densification in Printed Films Using Cu(II) Complex Ink

Effect of the Amine Concentration on Phase Evolution and Densification in Printed Films Using Cu(II) Complex Ink

Direct Laser Printing for Organic Electronics

System integration of smart packages using printed electronics

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