Low Temperature Optodic Bonding for Integration of Micro Optoelectronic Components in Polymer Optronic Systems

Wang, Y.; Overmeyer, Ludger

doi:10.1016/j.protcy.2014.09.013

Cited by 10 publications

(8 citation statements)

References 5 publications

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“…However, we have to consider its low glass transition temperature (Tg) of 105 °C, which poses a big challenge of controlling the thermal loading while being processed. In order to comply with this, we developed a low temperature bonding technology, the so-called optodic bonding [4] [5]. The key solution here is the utilization of the UV-irradiation as driving energy instead of the thermal effect to complete the bonding process.…”

Section: Optodic Bonding For the Surface Integration Of Bare Optoelecmentioning

confidence: 99%

Optical coupling of bare optoelectronic components and flexographically printed polymer waveguides in planar optronic systems

et al. 2016

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Large scale, planar optronic systems allowing spatially distributed functionalities can be well used in diverse sensor networks, such as for monitoring the environment by measuring various physical quantities in medicine or aeronautics. In these systems, mechanically flexible and optically transparent polymeric foils, e.g. polymethyl methacrylate (PMMA) and polyethylene terephthalate (PET), are employed as carrier materials. A benefit of using these materials is their low cost. The optical interconnections from light sources to light transmission structures in planar optronic systems occupy a pivotal position for the sensing functions. As light sources, we employ the optoelectronic components, such as edgeemitting laser diodes, in form of bare chips, since their extremely small structures facilitate a high integration compactness and ensure sufficient system flexibility. Flexographically printed polymer optical waveguides are deployed as light guiding structures for short-distance communication in planar optronic systems. Printing processes are utilized for this generation of waveguides to achieve a cost-efficient large scale and high-throughput production. In order to attain a high-functional optronic system for sensing applications, one of the most essential prerequisites is the high coupling efficiency between the light sources and the waveguides. Therefore, in this work, we focus on the multimode polymer waveguide with a parabolic cross-section and investigate its optical coupling with the bare laser diode. We establish the geometrical model of the alignment based on the previous works on the optodic bonding of bare laser diodes and the fabrication process of polymer waveguides with consideration of various parameters, such as the beam profile of the laser diode, the employed polymer properties of the waveguides as well as the carrier substrates etc. Accordingly, the optical coupling of the bare laser diodes and the polymer waveguides was simulated. Additionally, we demonstrate optical links by adopting the aforementioned processes used for defining the simulation. We verify the feasibility of the developed processes for planar optronic systems by using an active alignment and conduct discussions for further improvements of optical alignment.

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Section: Optodic Bonding For the Surface Integration Of Bare Optoelecmentioning

confidence: 99%

Optical coupling of bare optoelectronic components and flexographically printed polymer waveguides in planar optronic systems

et al. 2016

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“…On the basis of the sideway optode, whose setup and working principle has been introduced in detail in [26], the optode for irradiation from the bottom is realized and integrated in the same setup. By equipping two LED-UV lamps on the side and employing a mirror with an average UV reflectivity higher than 96 %, the setup is used as a sideway optode, while it is used as an optode for irradiation from the bottom when employing a transparent glass with a high UV transmission degree instead of the UV-reflective mirror and placing a LED-UV lamp under the glass.…”

Section: Optode Setupmentioning

confidence: 99%

“…With respect to the optode from the bottom, UV irradiation is emitted from the LED lamp, passes through the transparent glass and subsequently through the polymer film, and finally reaches the contact spot, where the UV-curing adhesive lies. According to the investigation of UV irradiation technology [26] we employed the same UV-LED lamp with a wavelength of 385 nm adopted to the UV transmission property of PMMA and PET (Section 2.3) as the irradiation source for the optode from the bottom as for the sideway one. To change the irradiation direction by 90…”

Section: Optode Setupmentioning

confidence: 99%

“…The integration can be realized by designing an underplate to replace the heat plate which serves as a thermode. As introduced [26], this underplate has to provide the vacuum function to get the lightweight and flexible polymer films fixed onto the surface. It helps to maintain the positioning accuracy of small components during the bonding process.…”

Section: Optode Setupmentioning

confidence: 99%

“…It helps to maintain the positioning accuracy of small components during the bonding process. In [26], the vacuum was realized by building a channel in shape of a circle consisting of small holes around the contact spot on the surface of the underplate, which, however, resulted in an inhomogeneous vacuum function. It can be seen that the polymer film bows in the middle or tilts at the edge.…”

Section: Optode Setupmentioning

confidence: 99%

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Optodic bonding of optoelectronic components in transparent polymer substrates-based flexible circuit systems

et al. 2015

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In the field of modern information technology, optoelectronics are being widely used, and play an increasingly important role. Meanwhile, the demand for more flexible circuit carriers is rapidly growing, since flexibility facilitates the realization of diverse functions and applications. As a potential candidate, transparent polymer substrates with a thickness of about a hundred micrometers by virtue of their low cost and sufficient flexibility are getting more attention. Thus, accomplishing an integration of optoelectronic components into polymer based flexible circuit systems increasingly is becoming an attractive research topic, which is of great significance for future information transmission and processing. We are committed to developing a new microchip bonding process to realize it. Taking into account the fact that most economical transparent polymer substrates can only be processed with restricted thermal loading, we designed a so-called optode instead of a widely adopted thermode. We employ UV-curing adhesives as bonding materials; accordingly, the optode is equipped with a UV irradiation source. An investigation of commercial optoelectronic components is conducted, in which their dimensions and structures are studied. While selecting appropriate transparent polymer substrates, we take their characteristics such as UV transmission degree, glass transition temperature, etc. as key criterions, and choose polyethylene terephthalate (PET) and polymethyl methacrylate (PMMA) as carrier materials. Besides bonding achieved through the use of adhesives cured by the optode, underfill is accordingly employed to enhance the reliability of the integration. We deposit electrical interconnects onto the polymeric substrate to be able to bring the optoelectronic components into electrical operation. In order to enlarge the optical coupling zone from component to substrate within the proximity of the adhesive or underfill, we employ transparent interconnects made of indium-tin-oxide. We present the results of the performance tests, including the contact resistances, mechanical tests and environmental tests.

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Technology for polymer-based integrated optical interferometric sensors fabricated by hot-embossing and printing

Xiao

Hofmann

Sherman

et al. 2015

2015 China Semiconductor Technology International Conference

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Low Temperature Optodic Bonding for Integration of Micro Optoelectronic Components in Polymer Optronic Systems

Cited by 10 publications

References 5 publications

Optical coupling of bare optoelectronic components and flexographically printed polymer waveguides in planar optronic systems

Optical coupling of bare optoelectronic components and flexographically printed polymer waveguides in planar optronic systems

Optodic bonding of optoelectronic components in transparent polymer substrates-based flexible circuit systems

Technology for polymer-based integrated optical interferometric sensors fabricated by hot-embossing and printing

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