2012
DOI: 10.1557/opl.2012.526
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Low-temperature Phosphorus Doping To Silicon Using Phosphorus-related Radicals

Abstract: Phosphorus (P) doped ultra thin n+-layer is formed on crystalline silicon (c-Si) at low substrate temperatures of 80 – 350 °C using radicals generated by the catalytic reaction of phosphine (PH3) with a tungsten catalyzer heated at 1300 °C. The sheet carrier concentration obtained by Hall effect is in the range between 3×1012cm-2 and 8×1012cm-2. The distribution of P atoms obtained by secondary ion mass spectrometry (SIMS) indicates that P atoms locate within the depth of 4 nm from surface and the profile has … Show more

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