2007
DOI: 10.1149/1.2717367
|View full text |Cite
|
Sign up to set email alerts
|

Low-Temperature Preparation of Metallic Ruthenium Films by MOCVD Using Bis(2,4-dimethylpentadienyl)ruthenium

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

2
26
0

Year Published

2007
2007
2022
2022

Publication Types

Select...
6
2

Relationship

0
8

Authors

Journals

citations
Cited by 29 publications
(28 citation statements)
references
References 13 publications
2
26
0
Order By: Relevance
“…Characteristic Ru peaks for 3d 3/2 and 3d 5/2 locate at 284 and 280 eV. These peak positions are in agreement with those earlier observed in different studies on Ru films [18,19,25,44,45]. The profiles of the Ru peaks indicate that the influence of the residual carbon is weak, i.e.…”
Section: Growth On Tiosupporting
confidence: 91%
See 2 more Smart Citations
“…Characteristic Ru peaks for 3d 3/2 and 3d 5/2 locate at 284 and 280 eV. These peak positions are in agreement with those earlier observed in different studies on Ru films [18,19,25,44,45]. The profiles of the Ru peaks indicate that the influence of the residual carbon is weak, i.e.…”
Section: Growth On Tiosupporting
confidence: 91%
“…To mention a few, (2,4-dimethylpentadienyl) (ethylcyclopentadienyl)ruthenium [24], bis (2,4-dimethylpentadienyl) ruthenium [25], triruthenium dodecacarbonyl [9] and bis(2,2,6, 6-tetramethyl-heptane-3,5-dionato)(1,5-cyclooctadiene)ruthenium [26], have been applied as Ru precursors in CVD process. Bis(cyclopentadienyl)ruthenium [18][19][20], bis(ethylcyclopentadienyl)ruthenium [19,27], N,N-dimethyl-1-ruthenocene [28], 2,4-(dimethylpentadienyl) (ethylcyclopentadienyl) ruthenium, i.e.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…It is not easy to achieve geometrically the required capacitor area (and requisite switched charge for the sense amplifiers to discriminate between a "1" and a "zero") while having such a small area projected onto the plane of the chip. The ways of doing this include both ultra-lithography and selfassembly techniques [2,3], and they consist of dielectrically coated trenches [4,5] and nano-tubes [6], and the use of nano-wires such as ZnO [7][8][9] or multiwalled carbon nano-tubes (MWCNTs) conformally coated with oxides [10]. An alternative scheme is to use ferroelectric films as the gate in field effect transistors [11,12], but these suffer from retention loss (diminishing stored charge) due to the need to ground the gate during read operations.…”
Section: Future Requirementsmentioning
confidence: 99%
“…CVD Ru films have been deposited using a number of organometallic precursors, including the carbonyl-containing compounds, such as Ru 3 (CO) 12 [2,3]; b-diketonate complexes, such as Ru(dpm) 3 (dpm = dipivaloylmethanate) [4]; pyrazolate-containing compounds, such as Ru(CO) 3 (3,5-bis(trifluoromethyl) pyrazole) [5]; and the family of compounds containing cyclopentadienyl and pentadienyl ligands, such as Ru(Cp) 2 (Cp = cyclopentadienyl) [6,7], Ru(EtCp) 2 (EtCp = ethylcyclopentadienyl) [8,9], and Ru (DMPD) 2 (DMPD = 2,4-dimethylpentadienyl) [10]. All of the aforementioned precursors are solid at room temperature, except for Ru(EtCp) 2 .…”
Section: Introductionmentioning
confidence: 99%