Low temperature processing of conformal TiN by ACVD (advanced chemical vapor deposition) for multilevel metallization in high density ULSI devices

Kang, Sang Bom; Chae, Yongkee; Yoon, Myung‐Han; Leem, Hyun-Jeong; Park, C.S.; Lee, S.I.; Lee, M.Y.

doi:10.1109/iitc.1998.704763

Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102)

DOI: 10.1109/iitc.1998.704763

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Low temperature processing of conformal TiN by ACVD (advanced chemical vapor deposition) for multilevel metallization in high density ULSI devices

Sang Bom Kang

Yongkee Chae²,

Myung‐Han Yoon³

et al.

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Low temperature processing of conformal TiN by ACVD (advanced chemical vapor deposition) for multilevel metallization in high density ULSI devices

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