Low Temperature Sealing Process and Properties of Kovar Alloy to DM305 Electronic Glass

Abstract

The low temperature sealing of Kovar alloy to DM305 electronic glass was realized by using lead-free glass solder of the Bi2O3-ZnO-B2O3 system in atmospheric environment. The sealing process was optimized by pre-oxidation of Kovar alloy and low temperature founding of flake glass solder. The effects of sealing temperature and holding time on the properties of sealing joint were studied by means of X-ray diffraction (XRD), scanning electron microscope (SEM), energy dispersive X-ray spectroscopy (EDS), etc. The results showed that the pre-oxidized Kovar alloy and DM305 electronic glass were successfully sealed with flake glass solder at the sealing temperature of 500 °C for 20 min. Meanwhile, the joint interface had no pores, cracks, and other defects, the shear strength was 12.24 MPa, and the leakage rate of air tightness was 8 × 10−9 Pa·m3/s. During the sealing process, element Bi in glass solder diffused into the oxide layer of Kovar alloy and DM305 electronic glass about 1 μm, respectively.

Joining of Hypereutectic Al-50Si Alloys Using Lead-Free Brazing Filler Glass in Air

“…The macro morphology and SEM image of brazing filler glass are presented in Figure 2 . The chemical compositions of this brazing filler glass are shown in Table 1 , which is similar to the glass used in our previous work [ 8 ]. As can be seen from Figure 2 , the low-temperature glass powder is a fine yellow powder.…”

“…[ 3 , 4 , 5 , 6 ]. In particular, for the T/R module of phased array radar, the weight of the phased array radar can be greatly reduced when hypereutectic Al-Si alloys are used to replace the commonly used Kovar alloy [ 7 , 8 ], which has important economic value. High-quality joining of the two materials is a key factor for the practical application of these materials.…”

Techniques and Materials for Optical Fiber Sensors Sealing in Dynamic Environments with High Pressure and High Temperature

“…A classical approach is to make the matching of the coefficient of thermal expansion of the materials or, in a no-matching case, choose a material with a coefficient of thermal expansion higher than the glass to have glass compression [ 5 ]. However, in high temperatures, other effects can appear that compromise the final quality of the sealing [ 6 ]. Weight loss in high temperatures for sealing materials directly affects the efficiency of the seal.…”

Effects of Chloride Ions and Nitrate Ions on the Anodic Dissolution of Iron in Sulfuric Acid Solution

“…Pitting may cause tremendous losses and damages for its unpredictable nature and rapid propagation. Chloride ions (Cl − ions) usually induce pitting by breaking down the passive film for its aggressiveness to metallic materials [1][2][3][4][5][6][7][8][9][10], so the study on the mechanisms of chloride corrosion is of theoretical and practical significance.…”