Low temperature snap cure thermoset adhesives with good worklife

Gillissen, Stijn; Nelis, E.; Wuytswinkel, G. van; Pater, Monika; Cheng, Chih-Min; Buffa, V.; O'Hara, W.B.; Xia, Bo; Shah, J.G.

doi:10.1109/polytr.2005.1596510

Cited by 5 publications

(3 citation statements)

References 1 publication

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“…[2] Structural adhesives require mixing of epoxy/hardener resins or thermal activation of one-pot epoxy/hardener blends (thermocuring), which leads to energy losses and stress/strain mismatches due to non-uniform temperature cycling of the substrates and resin. Attempts to overcome these impediments have led to alternative methods such as snap-cure epoxy [3][4][5], photocuring [6,7], electron beam curing [8], and electrocuring. [9][10][11][12] Snap-cure thermosets are one pot adhesives that rapidly cure within min.…”

Section: Introductionmentioning

confidence: 99%

Magnetocuring of temperature failsafe epoxy adhesives

Chaudhary

Ramanujan

et al. 2020

Applied Materials Today

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Section: Introductionmentioning

confidence: 99%

Magnetocuring of temperature failsafe epoxy adhesives

Chaudhary

Ramanujan

et al. 2020

Applied Materials Today

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“…Development of one-pot adhesives aims to replace two-part adhesives, as one-pot formulations have the advantages of on-demand curing, extended pot-life, automation, and simplified hardware for application. One-pot adhesives are activated (initiation of resin polymerization) through an external stimulus such as temperature or irradiation, e.g., snap-cure thermosets, , electron beam/γ-cured epoxy, or photocured acrylates. , Despite the advances in electropolymerization and electroconducting polymers, − no structural adhesives (e.g., epoxy or acrylate resins) have been reported that allow one-pot electrocuring or adhesives that could be initiated by voltage with current-controlled material properties. Perhaps the most pressing challenge preventing such formulations is the electrically insulating properties of the liquid monomer and cross-linked matrix resinsreminiscent of organic solvents.…”

Section: Introductionmentioning

confidence: 99%

Voltage-Activated Adhesion through Donor–Acceptor Dendrimers

et al. 2018

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Previous investigations on voltage-activated adhesives were restricted to aqueous solvents, where current directed crosslinking competed with water electrolysis.Replacing aqueous would expand applications of electrocuring technology and avoid excessive foaming, but many organic solvents have high ohmic resistances that prevent electrical conduction. These impediments were overcome through internal grafting of ferrocene (Fc) and diazirine (Dz) donor-acceptor pairs on fifth generation polyamidoamine (G5-PAMAM) dendrimers, forming G5-Fc-Dz cografted conjugates, where Fc internal additives provided an instantaneous conductive hole (+) network towards the redox conversion of diazirine to carbene insertion adhesion in non-toxic organic solvents of DMSO, DMF, and PEG400. Size exclusion chromatography and 1 H, 19 F NMR evaluated the formulations before and after electrocuring to quantitate grafting ratios and crosslinked dendrimers. Cyclic voltammetry confirmed the retained redox behavior of grafted Fc and Dz.Real-time electro-rheology established the dependence of crosslinking kinetics and adhesion strength on applied voltage. Liquid G5-Fc 15 -Dz 30 conjugates reached gelation within 2 min and with a storage modulus up to 3.4 ± 0.5 kPa. For the first time, a model system demonstrates the design components necessary towards organic, voltage-activated one-pot adhesives. This has broad implications for adhesives, cosmetics, implantable biomaterials, and flexible biosensors.

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“…This may induce the destruction of the adhesive bonding joint influence. Recently, the mandrel bend test was employed by Gillissen et al [3] to evaluate the flex feature of the dummy tags. They found the stress imposed by this test has a bit influence on the conductivity of adhesive joint.…”

Section: Introductionmentioning

confidence: 99%

Reliability of RFID tag inlay assembled by anisotropic conductive adhesive

Cai

et al. 2008

2008 2nd Electronics Systemintegration Technology Conference

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ACA bonding is one of the main stream in a mass production for the fast and low cost RFID tag inlay assembly, however, its reliable issue is facing the increasing challenge due to the trend of using low cost materials and fast process. In this work, ACA was prepared by mixing Ag particles into thermoset epoxy resin. The inlays were manufactured by assembling the RFICs in a flip chip mode with this kind of ACA on the aluminum/PET antenna under 180°C, 12 sec. To investigate the variation of the contact resistance and the flex behavior, some RFICs were sputtered with a gold film on their bump face and became a conductor on the aluminum antenna terminals. The ACA assembled inlays were submitted to various electric and mechanical reliability tests. It was found that the resistance of the inlay with dummy die exhibited a periodic variation but totally an ascending trend in a wind test, indicating that the flex or bend action had a large influence on the conductivity of the adhesive joint. Further, pure bend test with die facing down exhibited a less damage on the resistance than that with die facing up, because the former exerts a press while the latter was tearing. Although the resistance shift of the adhesive joint may occur, the high frequency regular inlays of 13.56MHz remained 10 cm response distance upon hot humidity test and the 50 periods wind test. The results suggested that an improvement is necessary on the aluminum-antenna inlay packaged by ACA.

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Low temperature snap cure thermoset adhesives with good worklife

Cited by 5 publications

References 1 publication

Magnetocuring of temperature failsafe epoxy adhesives

Magnetocuring of temperature failsafe epoxy adhesives

Voltage-Activated Adhesion through Donor–Acceptor Dendrimers

Reliability of RFID tag inlay assembled by anisotropic conductive adhesive

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