Low Temperature Solder - A Breakthrough Technology for Surface Mounted Devices

Sahasrabudhe, S.; Mokler, Scott; Renavikar, M.; Sane, Sandeep; Byrd, Kevin; Brigham, Eric; Jin, Owen; Goonetilleke, P.C.; Badwe, Nilesh; Parupalli, Satish

doi:10.1109/ectc.2018.00222

Cited by 34 publications

(4 citation statements)

References 3 publications

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“…A potential alternative to these lead-free alloys is the low-melting solder alloy BiSn42 or BiSn42Ag1. The lower melting point of 138 °C or 139 °C respectively allows soldering processes to be carried out at a lower peak temperature and, as a result, there is a significant reduction in the thermal energy required for this, which can reach up to 40 % [4]. In addition to the reduced energy consumption, lowering the processing temperature enables the use of materials and components that are less thermally stable, such as substrate materials with lower Tg values or optoelectronic components.…”

Section: Introductionmentioning

confidence: 99%

Composite soldering materials for high-temperature stable solder joints

Novikov,

Nowottnick

2023

IMAPSource Proceedings

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The thermal load on electronic assemblies is constantly increasing. The reasons for this increase are, on the one hand, the integration of power electronic components in an ever smaller space and thus an increasing power density and, on the other hand, the increasingly harsh environmental conditions with high temperature load. In addition to electronic components and substrate materials, the soldered connections are also exposed to this stress and must withstand it. The thermal stability is primarily determined by the melting temperature of the solder material or by the remelting temperature of the final solder interconnection. The remelting temperature can be purposefully increased through diffusion soldering. The advantage of diffusion soldering is that the operating temperature of the final solder joint can exceed the joining process temperatures. By using the composite soldering materials and diffusion soldering process it is possible to produce the solder interconnections that can withstand the high thermal and thermomechanical stress [1]. In this work, the composite solder material, consisting of the base solder alloy BiSnAg in eutectic composition with a melting point of 139 °C and added copper particles, was examined. The added copper particles have a direct influence on the dynamics of the diffusion process. Diffusion can also be influenced by adjusting the soldering process parameters, such as maximum temperature and time above liquidus of the base solder alloy, with the aim of achieving isothermal solidification. The solidification can take place through the parallel reactions: the reaction between tin and copper with the formation of high-melting intermetallic phases Cu3Sn and Cu6Sn5 and the growth of bismuth crystals through coarsening of the structure and tin depletion in the original eutectic solder alloy [2].

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Section: Introductionmentioning

confidence: 99%

Composite soldering materials for high-temperature stable solder joints

Novikov,

Nowottnick

2023

IMAPSource Proceedings

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“…There have been several Pb-Free solder materials found to substitute the Pb-based solder [1,7]. The most popular of these is a tin-bismuth (Sn-Bi) solder alloy [8,9]. Sn-Pb solder alloys have been replaced with Sn-Bi solder alloys as both solder alloys have the same mechanical properties at lower temperatures, and the melting point of the eutectic Sn-Bi alloys is much lower than that of the Sn-Pb alloys [10][11][12].…”

Section: Introductionmentioning

confidence: 99%

Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint

Bashir

Saad

Rizwan

et al. 2022

J Mater Sci: Mater Electron

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Due to the inherent environmental and health toxicities associated with lead, the use of environmental friendly lead-free solder materials has become an unavoidable trend in the electronic packaging industry. Sn-58Bi alloy is gaining attention for its good material properties such as low melting point, reliability and high tensile strength. The presence of the bismuth-rich phase increases the brittleness of Sn-58Bi alloy. The purpose of this study is to suppress the brittleness of Sn-58Bi alloy by the addition of different wt% (0, 10, 20, 30) of Sn powder. The powder metallurgy method was used to prepare the samples. Scanning electron microscopy and energy dispersive X-ray analysis were done to study the structural properties and a tensile test was done by a universal tensile machine to study the mechanical properties. The results reveal that the Sn particles partially dissolved in the Sn-58Bi solder matrix. The dissolution of Sn particles significantly improved the mechanical strength by 30%, suppressed the brittleness and improved the strain value by 1.3 times.

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“…The warpage induced by the thermal stress of the packages during the typical soldering process of Sn–Ag–Cu (SAC) solders usually results in non-wetting (NOW) soldering defect, soldering bridging and non-contact open (NCO) in solder joints. Low-temperature soldering technology, which is used as interconnects between the top SAC solder balls and the bottom PoP, is considered as a solution to such problems [2, 3]. During the low-temperature assembling processes, the SAC solder balls keep solid and merge with the molten/liquid low-temperature solders to form the hybrid solder joints at a soldering temperature below 200°C.…”

Section: Introductionmentioning

confidence: 99%

Board-level drop properties of Sn–49Bi–1Ag/Sn–3.0Ag–0.5Cu hybrid solder joints assembled by low-temperature soldering

Ren

Huang

2022

Science and Technology of Welding and Joining

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The Cu/Sn-49Bi-1Ag/Sn-3.0Ag-0.5Cu/Ni-P hybrid solder joints for customer electronics were assembled by low-temperature soldering at 170-200°C. The relationship between microstructural evolution and board-level drop failure mechanism of these solder joints during aging at 110°C was investigated. The Bi-rich zone increased from 24.98to 78.85% with increasing soldering temperature from 170 to 200°C. The growth rate of intermetallic compound (IMC) in 170-SAC/SB solder joints was approximately 3 times faster than that in 200-SAC/SB solder joints. The drop failure mechanism was explained that the drop-induced crack propagation path shifted from Bi phases in the as-soldered joints to the solder/Cu 6 Sn 5 interface in the aged joints, since the interfacial Cu 6 Sn 5 IMC grew thicker with increasing aging time.

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Low Temperature Solder - A Breakthrough Technology for Surface Mounted Devices

Cited by 34 publications

References 3 publications

Composite soldering materials for high-temperature stable solder joints

Composite soldering materials for high-temperature stable solder joints

Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint

Board-level drop properties of Sn–49Bi–1Ag/Sn–3.0Ag–0.5Cu hybrid solder joints assembled by low-temperature soldering

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