2015 IEEE 65th Electronic Components and Technology Conference (ECTC) 2015
DOI: 10.1109/ectc.2015.7159813
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Low temperature solid-state-diffusion bonding for fine-pitch Cu/Sn/Cu interconnect

Jian Cai
1
,
Junqiang Wang
2
,
Qian Wang
3
et al.
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Cited by 5 publications
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Synthesis and Characterization of One-Dimensional Cu-Sn Nanowire Diffusion Couples for Nanowire Assembly and Interconnection

Gao
1
,
Yin
2
,
Wang
3
et al. 2016
2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
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1
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Synthesis and Characterization of One-Dimensional Cu-Sn Nanowire Diffusion Couples for Nanowire Assembly and Interconnection

Gao
1
,
Yin
2
,
Wang
3
et al. 2016
2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
2
0
1
0
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Study on Ar(5%H2) Plasma Pretreatment for Cu/Sn/Cu Solid-State-Diffusion Bonding in 3D Interconnection

Wang
1
,
Wang
2
,
Wang
3
et al. 2016
2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
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Low Temperature Cu Nanorod/Sn/Cu Nanorod Bonding Technology for 3D Integration

Du
1
,
Shi
2
,
Tang
3
et al. 2016
2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
2
0
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