1995
DOI: 10.1016/0011-2275(95)90898-p
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Low temperature thermal properties of composite insulation systems

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Cited by 16 publications
(7 citation statements)
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“…The intensity of HAp phase crystallinity in HG00 is suppressed in comparision to that of HG05 scaffold, which is because of the rapid esterification and intermolecular hydrogen bonding within -COOH of gelatin and -OH of PVA and their cross linking in organic matrix. The C-H, C-O and O-H bonds become stronger at 77 K due to the shorter bond length caused by low temperature thermal shrinkage [11]. This phenomenon was also confirmed by FTIR analysis of HG00 and HG05 scaffolds as presented in Fig.…”
Section: Resultssupporting
confidence: 80%
“…The intensity of HAp phase crystallinity in HG00 is suppressed in comparision to that of HG05 scaffold, which is because of the rapid esterification and intermolecular hydrogen bonding within -COOH of gelatin and -OH of PVA and their cross linking in organic matrix. The C-H, C-O and O-H bonds become stronger at 77 K due to the shorter bond length caused by low temperature thermal shrinkage [11]. This phenomenon was also confirmed by FTIR analysis of HG00 and HG05 scaffolds as presented in Fig.…”
Section: Resultssupporting
confidence: 80%
“…Note that the contraction in the through-thickness direction is about 3 times that in the warp and fill directions. A similar behavior was reported previously for other S-2 glass fiber reinforced epoxy resin composites [18,19]. The coefficient of the thermal expansion in the z-direction is dominated by matrix, while warp and fill directions are dominated by the fiber.…”
Section: Thermal Expansion Coefficientsupporting
confidence: 78%
“…The thermal conductivity of the irradiated sample vs. temperature curve was not shown because it is similar as that of non-irradiated sample. The values of thermal conductivities of composites are in the range of 0.24-0.44 W (m K) À1 ,which are similar to the thermal conductivities for CTD 101 K/S-2 glass fiber composite with a fiber volume% between 45% and 55% [18,19].…”
Section: Thermal Conductivitymentioning
confidence: 94%
“…Hence, reducing the CTE of insulating materials is necessary. Introducing dimension stable inorganic filler to the polymeric matrix is a typical method [10]. The linear thermal expansion of the neat epoxy and the epoxy/BNS composites in parallel directions with different loading fractions as a function of temperature ranging from 77 to 298 K is shown in Figure 5a, where the CTE values are calculated by the slope of the curves as shown in the inset.…”
Section: Resultsmentioning
confidence: 99%
“…In a large fusion system, superconducting magnets and insulating materials are the important components. In order to guarantee the security of the fusion system, efficient heat dissipation and low thermal expansion at cryogenic conditions are required for insulating materials [9,10]. Thus, a thermally conductive but electrically insulating material appears to be highly desirable.…”
Section: Introductionmentioning
confidence: 99%