Low transmission loss flexible substrates using low Dk/Df polyimide adhesives

Tasaki, Takashi; Shiotani, Atsushi; Yamaguchi, Takashi; Sugimoto, Keisuke

doi:10.1109/eptc.2017.8277506

Cited by 7 publications

(3 citation statements)

References 3 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The semiconducting materials have identified five major growth applications: (1) mobile, such as smartphones, notebooks, wearables, tablets, etc., [1][2][3][4]; (2) high-performance computing (HPC), which is able to process data and perform complex calculations at high speeds on a supercomputer [5,6]; (3) self-driving cars [7]; (4) Internet Of Things (IOT), such as smart health and smart factories; [3,8,9] and (5) instant data (for edge computing) and big data (for cloud computing) [5,6]. To meet the requirements for boosting signal transmission speed/rate and managing a huge data flood, low-loss (dissipation factor or loss tangent) and permittivity materials are highly preferred [10,11].…”

Section: Introductionmentioning

confidence: 99%

Electrical, Microstructural and Physical Characteristics of Talc-based Cordierite Ceramics

Yahya

Soltan

Mahani

et al. 2022

Silicon

View full text Add to dashboard Cite

The aim of this work is to study the effect of various talc rocks for the preparation of talc-based cordierite ceramics. Raw talc and sintered cordierite-based ceramic samples (1000-1375ºC for 2 h) were characterized using XRD, XRF, TGA-DTG, laser PSDs, Archimedes method, SEM-EDAX and dielectric relaxation spectrometer (DRS). Results show that impurity oxide contents, particle size and mineralogical changes of green batches influenced the microstructure densification and crystallization of orthorhombic and hexagonal cordierite. The complex electric modulus plot shows the existence of two relaxation processes associated with the capacitive contribution grain boundaries and grain at low and high frequencies, respectively. The dielectric loss reached much lower values (0.0004–0.0007) for the ceramics composed of higher cordierite phase composition (87.00 to 92.00wt.%) that sintered at 1350 and 1375ºC. Such ceramics could be promising in electronic applications like capacitors, microwave devices and wireless communication.

show abstract

Section: Introductionmentioning

confidence: 99%

Electrical, Microstructural and Physical Characteristics of Talc-based Cordierite Ceramics

Yahya

Soltan

Mahani

et al. 2022

Silicon

View full text Add to dashboard Cite

show abstract

“…The semiconductor industry has identified five major growth engines (applications): (1) mobile, such as smartphones, smartwatches, notebooks, wearables, tablets, etc., [ 1 , 2 , 3 , 4 ]; (2) high-performance computing (HPC), also known as supercomputing, which is able to process data and perform complex calculations at high speeds on a supercomputer [ 5 , 6 ]; (3) autonomous vehicle (or self-driving cars) [ 7 ]; (4) IoT (internet of things), such as smart factories and smart health; [ 3 , 8 , 9 ] and (5) big data (for cloud computing) and instant data (for edge computing) [ 5 , 6 ]. The system-technology drivers such as 5G (fifth generation technology standard for broadband cellular networks) are boosting the growth of these five semiconductor applications.…”

Section: Introductionmentioning

confidence: 99%

Characterization of Low-Loss Dielectric Materials for High-Speed and High-Frequency Applications

Lee

Lau

et al. 2022

Materials

View full text Add to dashboard Cite

In this study, the Df (dissipation factor or loss tangent) and Dk (dielectric constant or permittivity) of the low-loss dielectric material from three different vendors are measured by the Fabry–Perot open resonator (FPOR) technique. Emphasis is placed on the sample preparation, data collection, and the comparison with the data sheet values provided from vendors. A coplanar waveguide with ground (CPWG) test vehicle with one of these raw dielectric materials (vendor 1) is designed (through Polar and simulation) and fabricated. The impedance of the test vehicle is measured by TDR (time-domain reflectometer), and the effective Dk of the test vehicle is calculated by the real cross-section of the metal line width, spacing, and thickness of the test vehicle and a closed-form equation. In parallel, the insertion loss and return loss are measured with the VNA (vector network analyzer) of the test vehicle. Finally, the measurement and simulation results are correlated. Some recommendations on the low-loss dielectric materials of the Dk and Df are also provided.

show abstract

“…Recently, the industry has taken great interest in reducing the weight and space charge of the circuit boards used for signal transmission of the sensors [ 1 , 2 , 3 , 4 ]. Therefore, studies to solve this problem by replacing the regularly printed circuit boards (PCBs) with flexible printed circuit boards (FPCBs) are now drawing attention [ 5 , 6 , 7 , 8 , 9 ]. If the regular PCBs are replaced by FPCBs, fuel efficiency is expected to be improved, reducing the weight of circuit boards connected to the vehicle.…”

Section: Introductionmentioning

confidence: 99%

Analysis of Microstrip Line with Asymmetric Arch Type Cross-Sectional Structure Using Micro Pattern Transfer Printing Method

Woo

Choi

et al. 2022

Sensors

View full text Add to dashboard Cite

This paper presents the manufacturing procedure and electrical properties of a microstrip line on flexible printed circuit boards (FPCBs) fabricated using the micro pattern transfer printing (MPTP) method for millimeter wave band application. The MPTP method presented herein is compared to the conventional FPCB process based on the degree of insertion loss as it pertains to the cross-sectional shape of the formed microstrip line. Electromagnetic field simulations were performed to confirm that the cross-sectional arch shape fabricated by the MPTP process reduces insertion loss in the high-frequency band. Based on the simulation, the microstrip transmission line was optimized to a width of 217 µm and a length of 30 cm, fabricated on a 50 µm thick poly-cyclohexylene dimethylene terephthalate (PCT) substrate to measure the insertion loss. The insertion loss fabricated using the MPTP method is measured as 0.37 dB/cm at 10 GHz, while the conventional FPCB is measured as 0.66 dB/cm. Through the analysis, it was confirmed that the FPCBs manufactured by the MPTP process show lower insertion loss compared to the conventional FPCBs.

show abstract

Low transmission loss flexible substrates using low Dk/Df polyimide adhesives

Cited by 7 publications

References 3 publications

Electrical, Microstructural and Physical Characteristics of Talc-based Cordierite Ceramics

Electrical, Microstructural and Physical Characteristics of Talc-based Cordierite Ceramics

Characterization of Low-Loss Dielectric Materials for High-Speed and High-Frequency Applications

Analysis of Microstrip Line with Asymmetric Arch Type Cross-Sectional Structure Using Micro Pattern Transfer Printing Method

Contact Info

Product

Resources

About