LPCVD silicon nitride uniformity improvement using adaptive real-time temperature control

Gumpher, John; Bather, Wayne; Wedel, D.

doi:10.1109/tsm.2002.807741

Cited by 13 publications

(4 citation statements)

References 1 publication

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“…In this case, the Peltier device transforms thermal energy into electrical energy by the Seebeck effect. The Electromotive Force E.M.F(V) is given by (7) where α, T h , and T c are the Seebeck coefficient and temperatures on the cold and hot sides of the Peltier.…”

Section: Peltier Thermoelectrical Equivalent Circuitmentioning

confidence: 99%

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Digital Twin-Enabled Modelling of a Multivariable Temperature Uniformity Control System

Araque,

Angel,

Viola

et al. 2024

Electronics

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The use of a digital twin as an enabling technology for industry 4.0 provides control systems engineers with novel tools for modelling, designing, and controlling complex systems, providing a deep understanding of the physical asset based not only on its physics but also the real system’s response. It is particularly critical for uniformity temperature control applications, where providing a reasonable model of the system’s diffusion is always affected by the physical behavior of the system’s components required for heating, cooling, or power distribution. In this paper, a digital twin is used to represent a multivariable thermoelectric system employed for temperature uniformity distribution control with potential applications in semiconductor manufacturing. The modelling employs a five-step methodological framework consisting of the stages: target system definition, system description, multiphysics and data-driven simulation, behavioral matching, and implementation to represent the system’s temperature distribution accurately. The temperature distribution is measured using an infrared thermal camera to perform model behavioral matching on heating and cooling temperature uniformity applications. The obtained results indicated that using digital twins not only increases the accuracy of the system’s representation but can also provide the system with novel information that can be leveraged for the design and implementation of smart control systems.

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Section: Peltier Thermoelectrical Equivalent Circuitmentioning

confidence: 99%

“…Likewise, Refs. [6,7] perform uniformity temperature control for lithography processes based on adaptive control or standard PI controllers based on reduced-order models of the wafer thermal behavior.…”

Section: Introductionmentioning

confidence: 99%

Digital Twin-Enabled Modelling of a Multivariable Temperature Uniformity Control System

Araque,

Angel,

Viola

et al. 2024

Electronics

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“…They implemented it to improve the rapid thermal chemical vapor deposition (RTCVD). Grumpher et al 8 demonstrated an effective approach to improve uniformity using adaptive real‐time temperature control that enables model‐based optimization of the process temperature of low‐pressure chemical vapor deposition (LPCVD). These research studies mainly treated chemical vapor deposition steps of the thermal oxidation, diffusion, or dielectric deposition stages.…”

Section: Introductionmentioning

confidence: 99%

A case study on modeling and optimizing photolithography stage of semiconductor fabrication process

Kim

Kwak

2010

Quality & Reliability Eng

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Photolithography in the semiconductor fabrication process is the core stage that determines the quality of semiconductor chips. The fabrication process is a batch process that causes variation in the quality of chips; thus, uniformity has always been an important goal of the process. This research is a case study on optimizing the photolithography stage to improve uniformity and the target achievement of critical dimension, a quality measure of semiconductor chips. The case study finds the optimal setting of input variables in photolithography by applying multivariate normal linear modeling with operational data obtained by sampling during manufacturing. The predicted performance of the optimal setting is found to be close to the limit of improvement estimated based on the model. For practitioners, several issues that can be considered for better optimization are also provided.

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“…1). One application of this trimming is in chip-to-chip compensation of the natural thickness variation across a wafer, which is typically at the percent level or higher for growth via low pressure chemical vapor deposition 18 . The dry etch trimming can also be used to realize thickness differences of several tens of nanometers, enabling multi-project wafers in which different thicknesses are needed to target, for example, frequency combs operating in different spectral bands or other χ (3) nonlinear nanophotonic devices.…”

mentioning

confidence: 99%

Tailoring Broadband Kerr Soliton Microcombs via Post-Fabrication Tuning of the Geometric Dispersion

Moille,

Westly,

Orji

et al. 2021

Preprint

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LPCVD silicon nitride uniformity improvement using adaptive real-time temperature control

Cited by 13 publications

References 1 publication

Digital Twin-Enabled Modelling of a Multivariable Temperature Uniformity Control System

Digital Twin-Enabled Modelling of a Multivariable Temperature Uniformity Control System

A case study on modeling and optimizing photolithography stage of semiconductor fabrication process

Tailoring Broadband Kerr Soliton Microcombs via Post-Fabrication Tuning of the Geometric Dispersion

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