Abstract:Recently, IBM announced the first silicon integrated circuit technology that incorporates copper on-chip wiring. This technology, which combines industry-leading CMOS ULSI devices with 6 levels of hierarchically-scaled Cu metallization, has reached the point of manufacturing, after passing the qualification tests required to prove feasability, yield, reliability, and manufacturability. The discussion of the change from Al to Cu interconnects for ULSI encompasses a wide variety of issues. This paper attempts to… Show more
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