1990
DOI: 10.1117/12.23017
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<title>Current HYMOSS Z-technology overview</title>

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Cited by 4 publications
(2 citation statements)
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“…The circuit multiplexes, filters and amplifies the signals and rejects the clutter. Figure 9 shows this design structure [32]. The demand for small, compact IR sensors can be met with enormous amount of signal processing squeezed in to a tiny volume.…”
Section: Readout Circuit Design Considerationsmentioning
confidence: 98%
“…The circuit multiplexes, filters and amplifies the signals and rejects the clutter. Figure 9 shows this design structure [32]. The demand for small, compact IR sensors can be met with enormous amount of signal processing squeezed in to a tiny volume.…”
Section: Readout Circuit Design Considerationsmentioning
confidence: 98%
“…The requirements for reduced volume, weight and interconnnection length associated with the minimization of thermal dissipation have increased the demand for using thinned wafers. The potential of ultrathin silicon wafers is undergoing rapid development in the field of microelectronic and microsystems technologies (sensors, actuators, ...) [3,4]. However, existing fabrication processes and manufacturing equipment are not compatible with the use of ultra-thin substrates, the most critical point being wafer handling.…”
Section: Introductionmentioning
confidence: 99%