&lt;title&gt;Degradation of thin copper conductors because of low temperature melting&lt;/title&gt;

Громов, Д. Г.; Гаврилов, С. А.; Redichev, E. N.; Mochalov, A. I.; Ammosov, R. M.

doi:10.1117/12.677086

Cited by 3 publications

(7 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In particular, Gromov et al [3] demonstrated the experimental dependence of the melting point of thin nickel films on the Al 2 O 3 surface on the film thickness in accordance with which the melting point of the nickel film with a thickness of 10 nm (T ≈ 800 K) is lower than the melting point of bulk nickel by about 900 K.…”

mentioning

confidence: 86%

See 1 more Smart Citation

Analysis of structural transformations and fluctuation effects in the nanosized nickel films in the vicinity of the melting point

Golik

Громов

Zhigal'skii

2012

J. Commun. Technol. Electron.

Self Cite

View full text Add to dashboard Cite

Metal films are widely employed in integrated cir cuits for the creation of active and passive elements. Recent interest in low dimensional conductors has been driven mainly by the applications in microelec tronics and other branches of science and technology. Conductors whose typical dimensions are less than 100 nm are called nanosized conductors.It is known that melting point T m of low dimen sional conductors (e.g., thin metal films), which char acterizes the beginning of the dispersion of the sample into droplets, is significantly lower than the melting point of bulk materials due to the dimensional effect in melting [1,2]. The surface energy determines the dependences of the phase transition temperatures on the film thickness and dimensions of small crystallites. The calculated and experimental results show signifi cant variations in the phase transition temperature in low dimensional conductors with variations in the film thickness [1-3].In particular, Gromov et al.[3] demonstrated the experimental dependence of the melting point of thin nickel films on the Al 2 O 3 surface on the film thickness in accordance with which the melting point of the nickel film with a thickness of 10 nm (T ≈ 800 K) is lower than the melting point of bulk nickel by about 900 K.In this work, we employ the scanning probe microscopy (SPM) in the study of the effect of heating temperature on the structure of the Ni film with an original thickness of 20 nm that is deposited on the sil icon oxide substrate (the thickness of the thermally grown silicon oxide SiO 2 is about 1 µm). Thin Ni film is deposited using the magnetron sputtering in the argon medium at a pressure of 7 × 10 -3 mmHg, a residual gas pressure in the chamber of no greater than 10 -5 mmHg, and room temperature. Then, we employ photolithography to create Ni film samples on the substrate.The main purpose of this work is the interpretation of the experimental results from [4], in accordance with which significant positive fluctuations of the resistance (or voltage across the sample at the given current) are observed in the vicinity of the melting point of the nanosized Ni films upon gradual slow heating. The results indicate an increase in the film resistance upon heating.For the interpretation of the above results, we use the SPM for the imaging of the surfaces of thin nickel films that are heated to different temperatures [5]. The analysis of the topology of thin nickel films is supple mented with the estimation of variations in the mean thickness upon heating to different temperatures due to the structural transformation in the film.Using the SPM, we study the surface topology of the nickel films at room temperature (T = 300 K) and determine the mean thickness: h = 20 ± 2 nm. Then, we perform the slow heating of the film samples. Figure 1 demonstrates the surface topologies of the nickel film samples with original thicknesses of 20 ± 2 nm after heating to temperatures of about 712, 737, and 752 K. The sample is heated in a vacuum chamber with a residual gas pressure of ...

show abstract

mentioning

confidence: 86%

“…The surface energy determines the dependences of the phase transition temperatures on the film thickness and dimensions of small crystallites. The calculated and experimental results show signifi cant variations in the phase transition temperature in low dimensional conductors with variations in the film thickness [1][2][3].…”

mentioning

confidence: 99%

Analysis of structural transformations and fluctuation effects in the nanosized nickel films in the vicinity of the melting point

Golik

Громов

Zhigal'skii

2012

J. Commun. Technol. Electron.

Self Cite

View full text Add to dashboard Cite

show abstract

“…At once, as been established during studies of the behavior of thin films of Ni [13], Cu [14][15][16], and Au [17][18][19], a strongly determined temperature of a pro cess of the decay into drops does not exist at all. In par ticular, the melting of the copper thin film with a thickness of 20 nm began at 610°С after 5 min, while its melting occurred also at 470°С, but after 3 h and …”

Section: Introductionmentioning

confidence: 94%

“…According to Eq. (1), a decrease in the melting temperature at a small thickness of the film can be quite significant and can come to several hundred degrees [12].…”

Section: Introductionmentioning

confidence: 99%

“…To study a thermal process of the melting-dispers ing of silver films, an automated measuring unit that allows one to measure the conductivity of a thin film in the vacuum heating process was used [12,13]. The resistances of all the materials that been used as a deposition surface are much larger than the analogous value for silver; therefore, a recorded signal fully char acterizes the state of a thin film.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Specifics of low-temperature melting and disintegration into drops of silver thin films

Kitsyuk

Громов

Redichev

et al. 2012

Prot Met Phys Chem Surf

Self Cite

View full text Add to dashboard Cite

The behavior of silver thin films on SiO 2 , amorphous carbon, and Al 2 O 3 surfaces upon thermal vacuum heating has been studied. It has been shown that Ag thin films decay into drops at heating. This pro cess does not have strongly defined temperature and takes place at temperatures that are essentially lower than the reference melting point of silver. At the same time, it shows a cumulative character. Decay of a silver thin film of 12 nm thickness on the SiO 2 surface occurs instantly at the temperature about 230°C, while, at a tem perature of 120°C, the process of decaying into drops starts after 11 h. It has been speculated that disintegra tion of the film goes through the stage of melting caused by the surface. The influence of the substrate surface on the disintegration process of films with different thicknesses has been studied. It has been shown that the evaporation process plays an essential role in the decay of thin films.

show abstract

Nano- and Microstructured Copper/Copper Oxide Composites on Laser-Induced Carbon for Enzyme-Free Glucose Sensors

Mamleyev

Weidler

Nefedov

et al. 2021

ACS Appl. Nano Mater.

View full text Add to dashboard Cite

Low-cost enzyme-free glucose sensors with partial flexibility adaptable for wearable Internet of Things devices that can be envisioned as personalized point-of-care devices were produced by electroplating copper on locally carbonized flexible meta-polyaramid (Nomex) sheets using laser radiation. Freestanding films were annealed in nitrogen and nitrogen/air working environments, leading to the formation of Cu microspheroids and CuO urchins dispersed on the substrate film. The aggregation mechanism, crystallographic properties, surface chemistry, and electrochemical properties of the films were studied using scanning electron microscopy, X-ray diffractometry, transmission electron microscopy, X-ray photoelectron spectroscopy, and cyclic voltammetry. Cu microspheroids and CuO urchins attained activity for glucose detection and showed improvement of amperometric sensitivity to 0.25 and 0.32 mA cm −2 mM −1 , respectively. The CuO urchin film retained its chemical composition after amperometric testing, and, by rinsing, allowed multiple repetitions with reproducible results. This study opens the possibility for the fabrication of durable composite biosensors with tailored shape, capable of implementation in flexible carriers, and microfluidic systems.

show abstract

<title>Degradation of thin copper conductors because of low temperature melting</title>

Cited by 3 publications

References 0 publications

Analysis of structural transformations and fluctuation effects in the nanosized nickel films in the vicinity of the melting point

Analysis of structural transformations and fluctuation effects in the nanosized nickel films in the vicinity of the melting point

Specifics of low-temperature melting and disintegration into drops of silver thin films

Nano- and Microstructured Copper/Copper Oxide Composites on Laser-Induced Carbon for Enzyme-Free Glucose Sensors

Contact Info

Product

Resources

About