<title>Laser and optical measurement techniques for characterization of microelectronic components</title>

Abstract

Using of several sophisticated optical techniques is reviewed to test the flatness of semiconductor wafers and to measure thin-film residual stresses, induced by various technological processes. Thin silicon membranes have been also inspected to obtain the membrane tension values and thickness variations. Besides this, experimentally by using of Laser Doppler Vibrometer the dynamics of MEMS microcomponents has been studied, too. In the paper, specific features of the methods, where performances and limitations, together with some remarks, regarding practical experiences of the exploitation, are reported.