1995
DOI: 10.1117/12.225278
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<title>Materials for mirror systems: an overview</title>

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Cited by 11 publications
(5 citation statements)
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“…Both describe the deformation of a part that is moved from a stable environment to another stable environment. The temperature-induced deformation is independent of the change path and a reversible deformation; the hysteresis-induced deformation is related to the change path, resulting in deformation that may be reversible or permanent [89][90][91][92].…”
Section: Dimensional Stabilitymentioning
confidence: 99%
“…Both describe the deformation of a part that is moved from a stable environment to another stable environment. The temperature-induced deformation is independent of the change path and a reversible deformation; the hysteresis-induced deformation is related to the change path, resulting in deformation that may be reversible or permanent [89][90][91][92].…”
Section: Dimensional Stabilitymentioning
confidence: 99%
“…The first is that CVD SiC is difficult to machine (low yield) and the dimensional tolerance capability and stability is often poor. 21 The second major issue with CVD SiC is that the internal stresses limit the size of the SiC blank that can be deposited. A typically cited thickness limitation is on the order of 0.6 cm.…”
Section: Sic Seed Particlementioning
confidence: 99%
“…The optical components must be lightweight and dimensionally stable under these conditions. 2 Thus, some of the more important material parameters for mirror performance include the coefficient of thermal expansion (CTE), thermal conductivity (k), and Young's modulus (E), which is a measure of material stiffness. Many applications require both lightweight and thermally stable mirrors.…”
Section: Introductionmentioning
confidence: 99%
“…SiC can provide the excellent weight and performance, not only for the component level but also for the system level. When SiC mirror is combined with SiC structure, the mirror and the structure have matching coeffi cient of thermal expansion (CTE) over all temperatures and thus create an thermal system, which signifi cantly reduces design complexity, weight, testing and integration [3,4] . The study on SiC systems was began from 1990s and concentrated in America and Europe [5,6] .…”
Section: Introductionmentioning
confidence: 99%