1998
DOI: 10.1117/12.320161
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<title>MEMS sensors and wireless telemetry for distributed systems</title>

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Cited by 13 publications
(7 citation statements)
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“…Our current research has been focused on developing arrayable, electronically read cantilevers in a commercial MEMS process [16]. We ultimately intend to put a variety of cantilevers with many different coatings on one single chip in order to detect many different compounds.…”
Section: 2: Present Researchmentioning
confidence: 99%
See 1 more Smart Citation
“…Our current research has been focused on developing arrayable, electronically read cantilevers in a commercial MEMS process [16]. We ultimately intend to put a variety of cantilevers with many different coatings on one single chip in order to detect many different compounds.…”
Section: 2: Present Researchmentioning
confidence: 99%
“…The integration of the previously mentioned building block elements has resulted in the production of an integrated chip named 'Wirtx1' [16]. Wirtx1 is a "smart" wireless sensor chip prototype, a simplified block diagram of which is shown in Figure 5, that has been designed in a 0.5-µm Hewlett-Packard CMOS process which incorporates temperature sensors, a four-channel analog multiplexer to support multiple sensor inputs, a 10-bit A/D converter with bandgap voltage reference, a programmable spread-spectrum generator with selectable families of Gold-code polynomials, an integrated state-machine system controller, high-speed data modulator, and output RF power amplifier.…”
Section: 2: Wirtx1 Chip Designmentioning
confidence: 99%
“…Many of the pieces needed to create an inexpensive multimeasurement instrument package are progressing very well. The microelectronics industry, with its high volume manufacturing, has created low-cost, reliable analog and digital circuits for conditioning, fi ltering, processing, and controlling sensor systems [13]. Microelectronics are also available for power management and robust communications [14].…”
Section: Recent Sensor Advancesmentioning
confidence: 99%
“…HE recent technological advances have allowed the development of complex Systems on a Chip (SoC) for such diverse applications as smart sensors [1], telecommunications or multimedia [2]. Most of these systems integrate heterogeneous blocks such as micro processors cores, digital signal processors, RAM/ROM memories, analog to digital converters… Furthermore, communications between a SoC and its environment often require the design of mixedsignal IPs (Intellectual Properties) such as bus interfaces (IEEE1394, USB,…) or wireless transceivers [3] [4] (IEEE802.11b, Bluetooth,…).…”
Section: Introductionmentioning
confidence: 99%