&lt;title&gt;Microchannel coolers for high-power laser diodes in copper technology&lt;/title&gt;

Krause, Volker; Treusch, Hans-Georg; Loosen, Peter; Kimpel, T.; Biesenbach, Jens; Koesters, Arnd; Robert, F.; Oestreicher, H.; Marchiano, Marcel; DeOdorico, Bernhard

doi:10.1117/12.176631

Cited by 16 publications

(4 citation statements)

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“…Entering fins thermal current from substrate is Q(co +co) J(y,O) = (2) (of The thermal current at the bottom of the channels can be treated as zero J(y,t) = 0 (3) The differential coefficient of the thermal current J equals to the thermal current into the cooling liquid in the Z direction. aJ(y, z) = 2j(y, z) (4) wc Here j is thermal current density from fins into fluid by force convection because of the difference of temperature between fins and fluid in X direction j(y,z) = (5) 2co N is the Nusselt number, 1c is the thermal conductivity of fluid0 The relation between the temperature ö(y,z) of cooling liquid and the thermal current density into cooling liquid is &(y,z) (DccV a) =2j(y,z) Seeing from the proceeding work, we can find that thermal resistance of the micro channel heat sink is only a function of the Wc,Wf, t when the pressure drop of fluid is constant.…”

Section: Simulating Calculation Analysismentioning

confidence: 99%

Optimal design of structure parameters for microchannel heatsink

et al. 2002

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In this paper, we main to optimize the micro channel heat sink structure parameters through simulating calculation approaches based on the analysis of the thermal characteristics. We also find the relation between the thermal resistance and the width of channels and fins of the micro channel heat sink. What's more, the effect of cooling liquid pressure drop and depth of channel on thermal resistance are given. We obtain the lowest thermal resistance at t=2OOim,w16Otm, u32Ojtm.

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Section: Simulating Calculation Analysismentioning

confidence: 99%

Optimal design of structure parameters for microchannel heatsink

et al. 2002

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“…Metallic microchannel coolers are used for waste heat removal in laser diode packages. These coolers are made from multiple layers of Cu sheet metal, patterned through photolithographic etching, micromilling, or laser micromachining, and assembled through diffusion bonding at temperatures ~800 °C [13,14]. During device operation, electrical current passes through the cooler to the cooling water, leading to electrochemical corrosion [15].…”

Section: Introductionmentioning

confidence: 99%

Internal passivation of Al-based microchannel devices by electrochemical anodization

Hymel

Guan

et al. 2015

J. Micromech. Microeng.

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Metal-based microchannel devices have wide-ranging applications. We report here a method to electrochemically anodize the internal surfaces of Al microchannels, with the purpose of forming a uniform and dense anodic aluminum oxide (AAO) layer on microchannel internal surfaces for chemical passivation and corrosion resistance. A pulsed electrolyte flow was utilized to emulate conventional anodization processes while replenishing depleted ionic species within Al microtubes and microchannels. After anodization, the AAO film was sealed in hot water to close the nanopores. Focused ion beam (FIB) sectioning, scanning electron microscopy (SEM), and energy dispersive spectroscopy (EDS) were utilized to characterize the AAO morphology and composition. Potentiodynamic polarization corrosion testing of anodized Al microtube half-sections in a NaCl solution showed an order of magnitude decrease in anodic corrosion current when compared to an unanodized tube. The surface passivation process was repeated for Al-based microchannel heat exchangers. A corrosion testing method based on the anodization process showed higher resistance to ion transport through the anodized specimens than unanodized specimens, thus verifying the internal anodization and sealing process as a viable method for surface passivation of Al microchannel devices.

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“…The application of lamination technology at the microscale is known as microlamination. Microlamination was used initially to fabricate microchannel heat exchangers for electronics cooling investigations [6][7][8]. Microlamination techniques have been used to fabricate microdevices for advanced climate control [9], solvent separation [10], dechlorination [11], microcombustion [12], fuel processing [13] and chemical sensing and microdialysis [14] among others.…”

Section: Introductionmentioning

confidence: 99%

Comparison of two passive microvalve designs for microlamination architectures

Paul¹,

Terhaar²

1999

J. Micromech. Microeng.

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Two passive, one-way microvalves have been created for use in microlamination architectures. The microlamination procedures involve the forming, alignment and bonding of thin metal laminae. A prerequisite to the creation of the flapper valve was the capability for selective bonding so as not to bond the flapper mechanism to the valve seat. A microprojection welding process was developed to meet this requirement. Projections as small as 125 µm in height were used to fabricate the microflapper valve. A microfloat valve, which consists of a small disk that floats up and down within a valve cylinder, was also fabricated. A capacitive dissociation process was developed to separate the small disk from within the valve body. Pressure drop tests were performed across each valve in order to evaluate the theoretical orifice size and the ratio of forward to backward flow over a wide range of mass flow rates. Forward flow was detected in all valves at pressures as small as 20 Pa. The results indicate that the best performing valve was the microfloat valve, with a theoretical orifice size of 629 µm and an average ratio of forward to backward flow of 12.76. Reasons given for these results include the ability for floats to reorient themselves to seal against surface asperities along the valve seat.

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<title>Microchannel coolers for high-power laser diodes in copper technology</title>

Cited by 16 publications

References 0 publications

Optimal design of structure parameters for microchannel heatsink

Optimal design of structure parameters for microchannel heatsink

Internal passivation of Al-based microchannel devices by electrochemical anodization

Comparison of two passive microvalve designs for microlamination architectures

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