“…A key application is the in-line monitoring of various wafer cleaning steps [625±627], especially HF cleaning sequences. Other applications include the monitoring of surface metal contamination, investigation of surface stability (via time-resolved w measurements), and the investigation of oxide charge in oxidized Si wafers [626]. Another advantage of this approach is that because only low-intensity illumination is used, a possible in¯uence of the illumination on the measured results (via, e.g., surface photochemistry or photo-desorption) is ruled out [625,628].…”