&lt;title&gt;Spectroscopic multilayer film thickness measurement system&lt;/title&gt;

Horie, Masahiro; Fujiwara, Nariaki; Kokubo, Masahiko; Kakiuchida, Hiroshi

doi:10.1117/12.240125

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“…In a dual/multi-layer structure, the thickness of each layer and the properties of the interface between two layers are important parameters that should be inspected. Such an inspection is normally carried out by a spectroscopic ellipsometer [4][5][6]. However, using such an instrument only one point can be measured at a time and the method provides information only on a particular layer of interest.…”

Section: Introductionmentioning

confidence: 99%

Investigation of a dual-layer structure using vertical scanning interferometry

Tay

Quan

2007

Optics and Lasers in Engineering

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Section: Introductionmentioning

confidence: 99%

Investigation of a dual-layer structure using vertical scanning interferometry

Tay

Quan

2007

Optics and Lasers in Engineering

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Whole film inspection using an extended source

Aiyer

Chau

1998

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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Currently, one measures dielectric thin film thickness on a wafer surface by sampling a predetermined number of points across the wafer. Point measurements do not provide accurate information on the trend in thickness variation across the wafer surface. Such information could be quite useful while developing new coating, deposition, etching, or polishing processes. Hence, a system that can map single layer film thickness across the whole wafer or a large area of the wafer will be very useful to process developers. In this article, we will discuss a technique that can map film thickness across a large area in a relatively short amount of time. It takes about 4 s to determine about 23 000 thickness values across the wafer. The approach has been breadboarded and demonstrated. Using a single wavelength, this technique makes it possible to characterize single layer film thickness without having to know optical constants of the substrate material.

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<title>Spectroscopic multilayer film thickness measurement system</title>

Cited by 2 publications

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Investigation of a dual-layer structure using vertical scanning interferometry

Investigation of a dual-layer structure using vertical scanning interferometry

Whole film inspection using an extended source

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