1995
DOI: 10.1117/12.210382
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<title>Structural design of ketal and acetal blocking groups in two-component chemically amplified positive DUV resists</title>

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Cited by 11 publications
(4 citation statements)
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“…This behavior of 3M6C-MBSA is similar to that of PHS. 10) In general, adequate protection ratios to control the dissolution rate below 0.1 nm/s and the T g above 100 C are required for the chemically amplified resist base polymer. Therefore, the 19.9 mol % protected 3M6C-MBSA (3M6C-MBSA-4) with a T g of 109 C was chosen for further investigation.…”
Section: Dsc Analysis and Dissolution Rate Measurementmentioning
confidence: 99%
“…This behavior of 3M6C-MBSA is similar to that of PHS. 10) In general, adequate protection ratios to control the dissolution rate below 0.1 nm/s and the T g above 100 C are required for the chemically amplified resist base polymer. Therefore, the 19.9 mol % protected 3M6C-MBSA (3M6C-MBSA-4) with a T g of 109 C was chosen for further investigation.…”
Section: Dsc Analysis and Dissolution Rate Measurementmentioning
confidence: 99%
“…Ketals are useful intermediates in organic synthesis; they protect carbonyl groups of ketones and aldehydes or the two hydroxyl groups of diols when organic transformations are performed [1][2][3]. Furthermore, ketals are compounds with exciting and well-known industrial and commercial applications in many fields, especially as surfactants and emulsifiers [4,5].…”
Section: Introductionmentioning
confidence: 99%
“…The problem of the airborne contamination could be solved to some extent by purifying the enclosed atmosphere [6], applying a protective topcoat [8] or annealing the resist [9]. In addition, it was demonstrated that insensitivity to basic airborne and substrate contaminants could be achieved by low activation energy deprotection chemistry [10][11][12][13][14]. In this case the deblocking reaction proceeds rapidly after exposure at room temperature.…”
Section: Introductionmentioning
confidence: 99%
“…An example for a binder resin using a low energy deprotection system is partially acetal protected poly-4-hydroxystyrene (PHS). Resists containing these polymers show good process latitude and high resolution in addition to their excellent post exposure delay time stability and superior substrate compatibility [11][12][13].…”
Section: Introductionmentioning
confidence: 99%