2002
DOI: 10.1117/12.462833
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<title>System-level modeling of microsystems using order reduction methods</title>

Abstract: In the development of microsystems, FEM simulators are used to investigate the behavior of system components with high accuracy. Generally, FEM simulations are time consuming. System-level models of all components are needed to allow a fast but sufficiently exact investigation of the system behavior to simulate entire microsystems. Typically, microsystems consist of nonelectrical components and electronic circuits. Providing models for electronic components and languages to describe the behavior of nonelectric… Show more

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Cited by 10 publications
(8 citation statements)
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“…Using an orthogonal projection method [10,11] we transform the above system into a low-dimensional sub-space…”
Section: Model Order Reductionmentioning
confidence: 99%
“…Using an orthogonal projection method [10,11] we transform the above system into a low-dimensional sub-space…”
Section: Model Order Reductionmentioning
confidence: 99%
“…For behavior modeling and system level simulation this means that the full order model (FOM) can be seamlessly replaced by the ROM. The transfer functionHðsÞ of the ROM is defined analogously to (4). Additionally, the m a -th order structure of (1) will be preserved, which prevents the costly alternative of reducing an equivalent first order system with increased state space dimension.…”
Section: Mormentioning
confidence: 99%
“…Therefore, these methods have proven as a cost efficient way to reduce the state space dimension of large scale dynamical systems during the last decades [1][2][3][4][5][6]. The lack of a global error bound does not carry weight in our applications, where the signals have a limited bandwidth and local convergence is sufficient.…”
Section: Introductionmentioning
confidence: 99%
“…To obtain more accurate data about the mechanical characteristics of MEMS, modeling and finite element analysis are needed to be developed in additional of theoretical models and experimental tests (Reitz et al 2002;Espinosa et al 2003;Paci et al 2005;Mariani et al 2008). The work developed and presented in this paper combines finite element analysis (FEA) with analytical models and experimental investigations for an accurate estimation of the elastic behavior of flexible MEMS components.…”
Section: Introductionmentioning
confidence: 99%