LTCC-based monolithic system-in-package (SiP) module for millimeter-wave applications

Abstract

A miniature LTCC system-in-package (SiP) module has been presented for millimeter-wave applications. A typical heterodyne 61 GHz transmitter (Tx) has been designed and fabricated in a type of the SiP module as small as 36 3 12 3 0.9 mm 3 . Five active chips including a mixer, driver amplifier, power amplifier, and two frequency multipliers were mounted on the single LTCC package substrate, in which all passive circuits such as a stripline (SL) BPF, 2 3 2 array patch antenna, surfacemount technology (SMT) pads, and intermediate frequency (IF) feeding lines have been monolithically embedded by using vertical and planar transitions. The embedded SL BPF shows the center frequency of 60.8 GHz, BW of 4.1%, and insertion loss of 3.74 dB. The gain and 3-dB beam width of the fabricated 2 3 2 array patch antenna are 7 dBi and 36 degrees, respectively. The assembled LTCC 61 GHz Tx SiP module achieves an output power of 10.2 dBm and an up-conversion gain of 7.3 dB. Because of the integrated BPF, an isolation level between a local oscillation (LO) and RF signal is below 26.4 dBc and the spurious level is suppressed by lower than 22.4 dBc. By using a 61 GHz receiver (Rx) consisting of off-the-shelf modules, wireless communication test was demonstrated by comparing measured IF spectrums at the Tx and Rx part. K E Y W O R D S antenna, BPF, LTCC, SiP Int. J. RF Microw. Comput. Aided Eng. 2016; 26: 803-811 wileyonlinelibrary.com/journal/mmce V C 2016 Wiley Periodicals, Inc. | 803

Data acquisition and processing circuit for high-temperature logging up to 200°C

“…In the data processing SiP, chips were packaged in one module, as shown in Figure 4. The chips were bonded to a low-temperature co-fired ceramic (LTCC) substrate, and outside interface pins were connected to the chips using high-temperature solder (Lee and Park, 2016). The multilayered LTCC substrate had 15 alumina (ceramic) layers and 15 gold (conductor) layers.…”

LTCC-Based System-in-Package (SiP) Technology for Microwave System Integration

“…In this chapter, a typical heterodyne 61 GHz transmitter (Tx) and a highly integrated 60 GHz amplitude shift-keying (ASK) transceiver (TRx) SiP module are presented in detail [29][30][31]. They have been designed and implemented by using the key technologies such as suppression unwanted resonant modes, low-loss vertical transitions and compact passive devices presented in the previous chapters.…”