LTCC system with new high-ɛr and high-Q material co-fired with conventional low-ɛr base material for wireless communications

Higuchi, Yukio; Sugimoto, Yasutaka; Harada, Jun; Tamura, Hiroshi

doi:10.1016/j.jeurceramsoc.2006.11.048

Cited by 31 publications

(18 citation statements)

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“…High reliability and temperature stability completed by a wide freedom in design and the possible integration of low resistivity conductor paths made of gold or silver boosts their application as radio frequency (RF) devices [18][19][20][21] and for smart system integration [22][23][24]. The composite character of the fired ceramic allows the variation of functional properties, such as permittivity, thermal expansion, or insulation resistance [25,26]. This flexibility, which entails the possibility of using a substrate with adapted CTE, was the first motivation for this study.…”

Section: Introductionmentioning

confidence: 99%

Magnetron Sputtered AlN Layers on LTCC Multilayer and Silicon Substrates

et al. 2018

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This work compares the deposition of aluminum nitride by magnetron sputtering on silicon to multilayer ceramic substrates. The variation of sputter parameters in a wide range following a fractional factorial experimental design generates diverse crystallographic properties of the layers. Crystal growth, composition, and stress are distinguished because of substrate morphology and thermal conditions. The best c-axis orientation of aluminum nitride emerges on ceramic substrates at a heater temperature of 150 • C and sputter power of 400 W. Layers deposited on ceramic show stronger c-axis texture than those deposited on silicon due to higher surface temperature. The nucleation differs significantly dependent on the substrate. It is demonstrated that a ceramic substrate material with an adapted coefficient of thermal expansion to aluminum nitride allows reducing the layer stress considerably, independent on process temperature. Layers sputtered on silicon partly peeled off, while they adhere well on ceramic without crack formation. Direct deposition on ceramic enables thus the development of optimized layers, avoiding restrictions by stress compensating needs affecting functional properties.

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Section: Introductionmentioning

confidence: 99%

Magnetron Sputtered AlN Layers on LTCC Multilayer and Silicon Substrates

et al. 2018

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“…The development of wireless communication components and modules with high wiring density, high volumetric effi ciency, high performance, high level of integration, excellent reliability, and low cost requires especially high quality dielectric materials [1,2] . The LTCC with high electrical conductivity metallization such as silver or copper have been identified to be a feasible solution for applications in the area of wireless communications [3] .…”

Section: Introductionmentioning

confidence: 99%

Preparation and properties of crystallizable Glass/Al2O3 composites for LTCC material

Shao

Zhou

Zhu

et al. 2011

J. Wuhan Univ. Technol.-Mat. Sci. Edit.

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The investigated low temperature Co fi red ceramics(LTCC) composite of 60wt% CaO-Al 2 O 3 -B 2 O 3 -SiO 2 glass and 40wt% α-Al 2 O 3 as a filler is a non-reactive system, which is a critical part of the low temperature Co fi red ceramics process. Through a study on densifi cation process, the phase transformation and microstructure can be revealed. Its composites typically consist of CaO-Al 2 O 3 -B 2 O 3 -SiO 2 glass and α-Al 2 O 3 powders of average particle size (D 50 =3.49 m). The sintering behavior, phase evaluation, sintered morphology, and microwave dielectric properties were investigated. In the fire range of 800 to 900 ℃, the composites were crystallized after completion of densifi cation. It is found that the composites start to densify at 825 ℃, simultaneously, the dielectric constant (ε r ) reaches its maximum. With increasing heat-treatment temperatures, due to the loose microstructure of the material, tanδ increases slightly. The last of the sintered samples were identifi ed as partly Anorthite at 850 ℃. At that temperature it has ε r of 7.9 and tanδ less than 1×10 3 , and can be used as a promising LTCC material.

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“…In recent years, miniaturization of electronic components and devices for wireless and mobile applications has been intensified. LTCC technology is one of the most promising methods for realizing this miniaturization [2]. The benefits of LTCC technology, such as the parallel manufacturing process with high yield and low cost, the ability to utilize highly conductive and inexpensive metallization, quick rounds in prototyping, environmental stability, compact structures, integration, etc., are well known [3].…”

Section: Introductionmentioning

confidence: 99%

Performance analysis of LTCC transformers for application in DC/DC converters

Stojanović

Marić

Radosavljevic

et al. 2010

Proceedings of 14th International Power Electronics and Motion Control Conference EPE-PEMC 2010

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In this paper, a novel design of a LTCC (low temperature co-fired ceramics) transformer for application in DC/DC converters is proposed. The transformer possesses a compact structure with the coils surrounded by dielectric (or ferrite) material and between the coils one dielectric layer is placed. Simulation and measuring results for inductance, coupling coefficient and quality factor of the proposed transformer are also presented. Testing LTCC transformer characteristics is illustrated using a forward type of DC/DC converter.

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LTCC system with new high-ɛr and high-Q material co-fired with conventional low-ɛr base material for wireless communications

Cited by 31 publications

References 0 publications

Magnetron Sputtered AlN Layers on LTCC Multilayer and Silicon Substrates

Magnetron Sputtered AlN Layers on LTCC Multilayer and Silicon Substrates

Preparation and properties of crystallizable Glass/Al2O3 composites for LTCC material

Performance analysis of LTCC transformers for application in DC/DC converters

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