Machining hole arrays in polyimide using a UV solid state laser and predetermined temporal pulse patterns

Mullan, Claire; Ilie, Diana; O'Connor, Gerard M.; Favre, Sebastian; Glynn, Thomas J.

doi:10.1117/12.700592

Cited by 6 publications

(5 citation statements)

References 18 publications

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“…Pan et al fabricated microscale hole arrays with different diameters and taper angles from 88° to 82° on a 50-μm-thick PI film 133 . Mullan et al reported arrays of reproducible holes with entrance diameters on the order of 14 μm and exit diameters on the order of 3 μm in 125-μm-thick PI films 134 .…”

Section: Micropatterning Of Polyimidementioning

confidence: 99%

Microfabrication of functional polyimide films and microstructures for flexible MEMS applications

Dong

Shen

et al. 2023

Microsyst Nanoeng

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Polyimides are widely used in the MEMS and flexible electronics fields due to their combined physicochemical properties, including high thermal stability, mechanical strength, and chemical resistance values. In the past decade, rapid progress has been made in the microfabrication of polyimides. However, enabling technologies, such as laser-induced graphene on polyimide, photosensitive polyimide micropatterning, and 3D polyimide microstructure assembly, have not been reviewed from the perspective of polyimide microfabrication. The aims of this review are to systematically discuss polyimide microfabrication techniques, which cover film formation, material conversion, micropatterning, 3D microfabrication, and their applications. With an emphasis on polyimide-based flexible MEMS devices, we discuss the remaining technological challenges in polyimide fabrication and possible technological innovations in this field.

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Section: Micropatterning Of Polyimidementioning

confidence: 99%

Microfabrication of functional polyimide films and microstructures for flexible MEMS applications

Dong

Shen

et al. 2023

Microsyst Nanoeng

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“…Since then, many research papers have been published on the interaction between laser energy and polymers, and the debate continues as to whether the interaction with a particular laser wavelength and specific pulse characteristic is photochemical, photo‐thermal, or a combination of both. Polyimide film is one of the most studied polymers used to characterize laser material interactions (Srinivasan, 1993; Pan et al , 2007; Luk'yanchuk et al , 1997; Yung et al , 2000, 2001; Ilie et al , 2005; Mullan et al , 2005, 2007; Himmelbauer et al , 1996; Küper et al , 1993; Metayer et al , 2001; Bäuerle et al , 1997; Shin et al , 2007; Gordon et al , 2007; Gu et al , 2002; Zweig and Deutsch, 1992; Urech et al , 2007; Li et al , 2007). In the electronics industry polyimide is used to insulate conducting layers for flexible printed circuit board (FPCB) because of its high electrical resistance.…”

Section: Introductionmentioning

confidence: 99%

“…Polyimide is also used for its good mechanical strength, high thermal properties, and resistance to abrasive chemicals. Most research papers have concentrated their research on the Dupont™ brand of polyimide films (Srinivasan, 1993; Luk'yanchuk et al , 1997; Ilie et al , 2005, 2007; Mullan et al , 2005, 2007; Himmelbauer et al , 1996; Küper et al , 1993; Metayer et al , 2001; Bäuerle et al , 1997; Pervolaraki et al , 2004; Li et al , 2004; Hauer et al , 2003; Shin et al , 2006). There are many suppliers of polyimide film within the FPCB industry, but there are no comparison studies indicating how the various properties of these films can be used for microvia drilling.…”

Section: Introductionmentioning

confidence: 99%

“…Dimensions of microvias when laser percussion drilled has been researched extensively (Ilie et al , 2005, 2007; Mullan et al , 2005, 2007; Shin et al , 2007; Gu et al , 2002). Many research studies use excimer lasers as noted above, but most FPCB manufacturers use Nd:YAG lasers operating at 355 nm.…”

Section: Introductionmentioning

confidence: 99%

“…Excimer lasers with their lower pulse frequencies have more time between pulses, which reduces the interaction with plasma shielding (Küper et al , 1993; Bäuerle et al , 1997; Lippert et al , 2003). Nd:YAG lasers at 266 and 355 nm tend to have more interactions with plasma shielding, which reduces etch rates with higher pulse frequencies (Ilie et al , 2005; Mullan et al , 2007; Kawamura et al , 1982; Srinivasan, 1993; Gordon et al , 2007).…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Laser microvia formation in polyimide thin films for metallization applications

Roeger

2011

Circuit World

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Purpose -The purpose of this paper is to demonstrate laser microvia drilling of polyimide thin films from multiple sources before metallic sputtering. This process flow reduces Flexible Printed Circuit Board (FPCB) material, chemical and operational costs by 90 per cent in the construction of flexible circuits. Design/methodology/approach -The UV laser percussion drilling of microvias in 25 mm thick polyimide films with low coefficients of thermal expansion (CTE) and elastic modulii was investigated. Results were obtained using Scanning Electron Microscopy and Surface Profilometry. Polyimide films tested included: Duponte Kapton w EN; Kolon w GP and LV; Apical w NPI; and Taimidee TA-T. Findings -There was no direct relationship between the top and bottom diameters and ablation depth rates between the polyimide films tested using the same test conditions. There was a direct relationship with exit diameters and etch rates at different laser pulse frequency rates and fluence levels. Laser pulse rates at 30 kHz produced 20 per cent larger exit diameters than at 70 kHz, however at 70 kHz the first pulse etched 16.5 per cent more material. High fluence levels etched more material but with a lower etch efficiency rate. Other microvia quality concerns such as surface swelling, membrane residues on the bottom side and surface debris inside the microvias were observed. Nanoscale powder-like surface debris was observed on all samples in all test conditions. Originality/value -This is the first comparison of material specifications and costs for films from multiple polyimide manufactures and laser microvia drilling. The paper also is the first to demonstrate results using a JDSUe Lightwave Q302 w laser rail. The results provide the first insights into potential microvia membrane issues and debris characteristics.

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Controlled process for polymer micromachining using designed pulse trains of a UV solid state laser

Ilie

Mullan

O’Connor

et al. 2007

Applied Surface Science

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Machining hole arrays in polyimide using a UV solid state laser and predetermined temporal pulse patterns

Cited by 6 publications

References 18 publications

Microfabrication of functional polyimide films and microstructures for flexible MEMS applications

Microfabrication of functional polyimide films and microstructures for flexible MEMS applications

Laser microvia formation in polyimide thin films for metallization applications

Controlled process for polymer micromachining using designed pulse trains of a UV solid state laser

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