Macromodel-based Signal and Power Integrity simulations of an LP-DDR2 interface in mSiP

Abstract

Signal and Power Integrity (SI/PI) analyses assume a paramount importance to ensure a secure integration of highspeed communication interfaces in low-cost highly-integrated System-in-Package(s) (SiP) for mobile applications. In an iterative fashion, design and time-domain SI/PI verifications are alternated to assess and optimize system functionality. The resulting complexity of the analysis limits simulation coverage and requires extremely long runtimes (hours, days). In order to ensure post-silicon correlation, electrical macromodels of Package/PCB parasitics and high-speed I/Os can be generated and included in the testbenches to expedite simulations. Using as example an LP-DDR2 memory interface to support the operations of a mobile digital base-band processor, we have developed and applied a macromodelling flow to demonstrate simulation run-time speedup factors (x1200+), and enable interface-level analyses to study the effects of Package/PCB parasitics on signals and PDNs, as well as the corresponding degradation in the timing budget.

Characteristics of a System in a Package with Silver Wires

“…These PCB platforms had the disadvantages of relatively large size, and their need for complicated signal net routing. System in a package (SiP) is an advanced technology developed to address the disadvantages of the PCB with the SoC/DDR2-SDRAM configuration [4][5][6][7]. However, high speed double-data-rate-three (DDR3) SDRAM technology is more suitable for modern consumer electronic products.…”