“…The high processing temperature results in large grains and increasing media noise, which are the main disadvantages for practical recording applications of the film. Therefore, many methods have been adopted to reduce the processing temperature, such as the introduction of underlayer [3][4][5][6] or top layer [7], the addition of third elements [8,9], multilayering [10,11], ion irradiation [12,13], in situ annealing [14,15], alternate monatomic layer deposition [16], and dynamic stress-induced ordering [17], and so on. In the present study, we present a simple method to get L1 0 FePt film at lower temperature with acceptable coercivity using AgCu underlayer.…”