With increasing demands for electrostatic control as scaling continues in today's transistors, low dimensional structures continue to gain attention as a pathway for future device scaling because they offer excellent electrostatic control while remaining compatible with straightforward lithography techniques.In particular, MoS2 has attracted interest for transistor applications because its large band gap allows for field effect devices with low off-current, unlike graphene [1]. One key bottleneck, however, is the realization of ohmic contacts on MoS2 to improve FET device on-state performance. With this in mind, we evaluate Ni and Pd contacts on MoS2 as potential alternatives to the already realized Au-MoS2 and Ti MoS2 contacts [1]. Back-gated transfer length method (TLM) structures with Au, Ni, and Pd contact metals were fabricated on exfoliated MoS2 flakes, with 300nm Si02 on degenerately doped Si as the substrate. The data indicate that Ni, like Au, makes an ohmic contact to the n-doped MoS2 while the Pd metal contact shows Schottky behavior.Figure 1 shows the alignment of the metal work-functions to the MoS2 bands for the high work function metals on which we focus in this work. Figure 2 shows representative Ia Vds characteristics at Vbg=SOV for the three contact metals on MoS2• The MoS2 flake thicknesses are Snm for Ni and 6nm for Au, measured by AFM, and � 13nm for Pd, estimated by optical contrast. One finds that the Ni and Au contacts are ohmic while the Pd contact shows Schottky behavior. Figure 3 shows the contact resistance (Re) as a function of back-gate voltage (Vbg), extracted using the TLM. Re for Ni and Au are found to be comparable, with a minimum Rc of about 4.SQ.mm at Vbg=SOV. The gate-dependent Rc reflects the gate modulation of the potential barrier at the metal-MoS2 interface. Considering charge-transfer at the metal MoS2 interface alone for these high work function metals, the different contact nature of Pd from Ni andAu is somewhat unexpected. Indeed, recent ab inito calculations suggest that the modification of the electronic states at the interface by the metal is the key to understanding the contact to MoS2, going beyond the simple charge-transfer considerations of a metal-semiconductor junction [2]. To investigate the Ni contact further, Rc was measured at low temperature via TLM, as shown in Figure 4, for a �6nm thick flake, as estimated by optical contrast. The Rc varies weakly with temperature, increasing by less than a factor of two from 238K to 78K for any Vbg• Enabled by the low temperature Ni ohmic contact, the sheet resistance and mobility of MoS2 could be extracted as shown in Figure S. The mobility, extracted from fits to the sheet resistance as a function of Vbg, is determined to be 48 cm 2 /Vs at 289K, increasing to 237 cm 2 /Vs at 78K due to decreased phonon scattering. The mobility of MoS2 could be significantly improved to several hundred cm 2 /Vs if its surface is passivated by atomic-layer-deposited dielectrics. [1, 3] The temperature dependence of the mobility is powe...