By laminating piezoelectric and flexible materials during the manufacturing process, we can improve the performance of electronic devices. In smart structure design, it is also important to understand how the functionally graded piezoelectric (FGP) structure changes over time when thermoelasticity is assumed. This is because these structures are often exposed to both moving and still heat sources during many manufacturing processes. Therefore, the electrical and mechanical properties of layered piezoelectric materials that are subjected to electromechanical loads and heat sources must be both analyzed theoretically and practically.Classical thermoelasticity cannot solve the problem of the infinite speed of heat wave propagation, so extended thermoelasticity models are proposed. In this paper, the Lord-Shulman theory with the idea of a memory-dependent derivative (MDD) was used to investigate how a moving axial heat source affects the thermomechanical sensitivity of a FGP rod.The physical characteristics of the FG rod are supposed to change exponentially when travelling in the direction of the rod axis. It is further assumed that the rod is held at both ends and that there is no voltage across them.Laplace transform procedures were used to obtain the physical fields being analyzed. A combination of measures of heterogeneity, kernel functions, time delays, and heat source velocities was used to make comparisons between the results discussed and those in previous literature.It was found that a higher value of the inhomogeneity index reduces the dynamic behavior to axial displacement, temperature change, and electric potential.