Abstract:Electronic packaging industries are in an ongoing transition to lead free soldering due to the adverse effect on environment and human health [1]. Sn-Ag-Cu (SAC) have been recognized as promising alternatives due to its low eutectic temperature, higher wettability and strength, superior resistance to creep and thermal fatigue. Surface roughness has a significant influence on mechanical parameters determined nanoindentation tests. Although research has been conducted to analyze the mechanical properties of bulk… Show more
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