Management of electronic board temperature using heat sink containing pure and microencapsulated phase change materials

Rostamian, Faezeh; Etesami, Nasrin; Haghgoo, Majid

doi:10.1016/j.icheatmasstransfer.2021.105407

Cited by 28 publications

(7 citation statements)

References 33 publications

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“…Namun, energi panas juga memiliki potensi besar untuk dikonversi menjadi energi lain yang lebih menguntungkan. Jika energi panas yang dihasilkan dari proses elektronik atau mekanik ini adalah produk sampingan, maka tentu saja energi tersebut perlu disalurkan dan dilepaskan ke udara terbuka agar tidak mengganggu operasi kinerja yang sedang berlangsung [1], [2]. Karena, jika energi panas yang dihasilkan meningkatkan suhu hingga batas maksimum, maka akan menyebabkan kegagalan sistem total.…”

Section: Pendahuluanunclassified

Preparasi Dan Modifikasi Sifat Adhesi Permukaan Metal Foam Untuk Meningkatkan Karakteristik Adhesi

Humaidi,

Suharlan

2024

J. Rek. Ener

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Permukaan metal foam telah berhasil dimodifikasi sehingga mendapatkan permukaan dengan sifat adhesi yang tinggi dengan sudut kontak sebesar 112° pada hari pertama pengamatan. Modifikasi permukaan metal foam dilakukan melalui prosedur pembersihan dan teknik penyemprotan sederhana menggunakan Super Nano hydrophobic Liquid Repellent. Tujuan utama dari penelitian ini adalah untuk mengeksplorasi pengaruh lapisan hidrofobik pada permukaan metal foam terhadap karakteristik kapilaritas yang dimiliki. Metal foam yang dilapisi dengan lapisan hidrofobik menyerap 0,03 gr air dalam 10 detik pertama, kondisi ini berlanjut untuk 50 detik berikutnya dan setelah 90 detik, pemompaan kapiler mencapai titik saturasi di mana jumlah air yang telah mengisi celah kapiler tidak dapat bergerak lagi karena jumlahnya telah mencapai maksimum. Dari penelitian ini juga diproleh kesimpulan bahwa semakin kecil sudut kontak metal foam, maka semakin meningkatkan tekanan kapilernya.

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Section: Pendahuluanunclassified

Preparasi Dan Modifikasi Sifat Adhesi Permukaan Metal Foam Untuk Meningkatkan Karakteristik Adhesi

Humaidi,

Suharlan

2024

J. Rek. Ener

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“…Results showed that the thermal conductivity increases by 26, 60 and 113.3% respectively for the mass fraction of CNTs 0.3%, 0.5%, and 1%. Rostamian et al [11] experimentally examined the performance of electronic board heat sink utilizing pure and microencapsulated PCMs. Different geometries of heat sink like Square with three fins and seven fins, circular with 12 fins have been used for investigation over a range of electrical power 5 to 18 W in two cases preset and pulsed power based on the board critical temperature of 80°C.…”

Section: Modelmentioning

confidence: 99%

Application of Semi-Circular Micro-Channel Heat Sink with Phase Change Material for Cooling of Electronic Devices

Chandra¹,

Prakash²,

Kumar³

et al. 2022

Phase Change Materials - Technology and Applications

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In today’s era demand of fast processing speed and superior performance of electronic devices creates the problem of huge amount of heat generation. About 100 W/cm2 heat fluxes has been generating from advanced microprocessors of latest electronic devices and heat dissipation limited to 37 W/cm2 for air cooling. Semi-circular micro-channel heat sink with Phase change materials still needs to be investigated for the cooling of latest electronic devices as combination of large heat transfer area within a small volume of heat sink and large latent heat released from PCM provides huge amount of heat transfer coefficient which is required to be achieved in the present work. Analytical study of micro-channel heat sink has been performed in the present work at a constant power supply of 95 W using PCM slurry at φ = 0.25 and φ = 0.50 for flow rate in the range of 75 ml/min to 300 ml/min. Heat transfer coefficient of slurry and Nu increases with increase in flow rate. At φ = 0.25 higher heat transfer coefficient and Nu has been observed than φ = 0.50 due to high viscous flow at higher concentration of PCM slurry in micro-channels.

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“…-To store and later release non-desired heat in photovoltaic/thermal systems working in hot weather conditions to enhance their efficiency [65][66][67][68][69][70]. -To manage the heat and improve the heat sink in electric and electronic devices [71][72][73][74].…”

Section: Uses and Applications Of Paraffinmentioning

confidence: 99%

Paraffin As a Phase Change Material to Improve Building Performance: An Overview of Applications and Thermal Conductivity Enhancement Techniques

Al-Yasiri

Szabó

2021

Renew. Energy Environ. Sustain.

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In recent years, phase change materials (PCMs) have increasingly received attention in different thermal energy storage and management fields. In the building sector, paraffin as a phase change material (PPCM) has been introduced as an efficient PCM incorporated in a building envelope, which showed remarkable results. However, the poor thermal conductivity of PPCM is still the topmost drawback in experimental and numerical investigations. In this paper, a general assessment of paraffins, their common uses and applications, have been presented with a particular focus on their potential in building envelope applications. Moreover, the general and desired properties of PPCM are highlighted and evaluated. The primary practical limitation of PPCM of poor thermal conductivity and their effect on PPCM performance is presented and discussed. Correspondingly, the popular techniques applied to improve the poor thermal conductivity are presented and discussed in four categories: the dispersion of nanoparticles, expanded graphite, metallic foam, and extended surfaces technique (fins). All in all, the analysed research works indicated that PPCM based building envelope applications could remarkably improve the thermal performance of buildings in terms of thermal load reduction, energy-saving and thermal comfort. Furthermore, the adoption of enhancement techniques is essential to improve the thermal performance of PPCM in building applications for better utilisation. This review provides a clear vision for the newcomers and interested parties about the main application aspects of PPCM in the building sector for further investigations towards technology commercialisation.

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Management of electronic board temperature using heat sink containing pure and microencapsulated phase change materials

Cited by 28 publications

References 33 publications

Preparasi Dan Modifikasi Sifat Adhesi Permukaan Metal Foam Untuk Meningkatkan Karakteristik Adhesi

Preparasi Dan Modifikasi Sifat Adhesi Permukaan Metal Foam Untuk Meningkatkan Karakteristik Adhesi

Application of Semi-Circular Micro-Channel Heat Sink with Phase Change Material for Cooling of Electronic Devices

Paraffin As a Phase Change Material to Improve Building Performance: An Overview of Applications and Thermal Conductivity Enhancement Techniques

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