The development of stable materials, processable on a
large area,
is a prerequisite for perovskite industrialization. Beyond the perovskite
absorber itself, this should also guide the development of all other
layers in the solar cell. In this regard, the use of NiO
x
as a hole transport material (HTM) offers several
advantages, as it can be deposited with high throughput on large areas
and on flat or textured surfaces via sputtering, a well-established
industrial method. However, NiO
x
may trigger
the degradation of perovskite solar cells (PSCs) when exposed to environmental
stressors. Already after 100 h of damp heat stressing, a strong fill
factor (FF) loss appears in conjunction with a characteristic S-shaped J–V curve. By performing a wide range of analysis
on cells and materials, completed by device simulation, the cause
of the degradation is pinpointed and mitigation strategies are proposed.
When NiO
x
is heated in an air-tight environment,
its free charge carrier density drops, resulting in a band misalignment
at the NiO
x
/perovskite interface and in
the formation of a barrier impeding hole extraction. Adding an organic
layer between the NiO
x
and the perovskite
enables higher performances but not long-term thermal stability, for
which reducing the NiO
x
thickness is necessary.