Manufacturing process of reproduction plate by nonmetallic materials reclaimed from pulverized printed circuit boards

Guo, Jie; Guo, Junchao; Cao, Bin; Tang, Yinen; Xu, Zhenming

doi:10.1016/j.jhazmat.2008.07.099

Cited by 16 publications

(7 citation statements)

References 12 publications

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“…UPRs find use in industrial applications because of their good mechanical properties especially when reinforced with fibers or fillers [42]. In order to take full advantage of the NMFs of waste PCBs, Zhenming Xu and his colleagues Jie Guo, Bin Cao, Jiuyong Guo from Shanghai Jiao Tong University have developed a novel technique to produce the non-metallic plate (NMP) by using unsaturated polyester resin as a bonding agent [37,43]. The waste PCBs used in their study are a kind of woven glass fabric copper clad laminate without electronic elements, so the NMFs only consists of Cu.…”

Section: Recycling the Nmfs From Waste Pcbs As A Filler For Thermosetmentioning

confidence: 99%

Recycling of non-metallic fractions from waste printed circuit boards: A review

Guo

2009

Journal of Hazardous Materials

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346

141

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Section: Recycling the Nmfs From Waste Pcbs As A Filler For Thermosetmentioning

confidence: 99%

Recycling of non-metallic fractions from waste printed circuit boards: A review

Guo

2009

Journal of Hazardous Materials

Self Cite

346

141

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“…Guo et al 173 reviewed the different options for recycling the nonmetallic fraction of waste PWBs, including physical methods (e.g., an additive to concrete) and chemical methods (e.g., pyrolysis). In addition, Guo et al 174 investigated using the nonmetallic fraction of PWBs remaining after metal recovery as a material for creation of value-added products.…”

Section: Marketsmentioning

confidence: 99%

Environmental Issues and Management Strategies for Waste Electronic and Electrical Equipment

Townsend

2011

Journal of the Air & Waste Management Association

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Issues surrounding the impact and management of discarded or waste electronic and electrical equipment (WEEE) have received increasing attention in recent years. This attention stems from the growing quantity and diversity of electronic and electrical equipment (EEE) used by modern society, the increasingly rapid turnover of EEE with the accompanying burden on the waste stream, and the occurrence of toxic chemicals in many EEE components that can pose a risk to human and environmental health if improperly managed. In addition, public awareness of the WEEE or "e-waste" dilemma has grown in light of popular press features on events such as the transition to digital television and the exportation of WEEE from the United States and other developed countries to Africa, China, and India, where WEEE has often not been managed in a safe manner (e.g., processed with proper safety precautions, disposed of in a sanitary landfill, combusted with proper air quality procedures). This paper critically reviews current published information on the subject of WEEE. The definition, magnitude, and characteristics of this waste stream are summarized, including a detailed review of the chemicals of concern associated with different components and how this has changed and continues to evolve over time. Current and evolving management practices are described (e.g., reuse, recycling, incineration, landfilling). This review discusses the role of regulation and policies developed by governments, institutions, and product manufacturers and how these initiatives are shaping current and future management practices.

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“…10 O tratamento mecânico é o menos agressivo ao meio ambiente e à saúde ocupacional, por gerar menos resíduos contaminantes. 10,11 Em geral, após a moagem prévia das PCI seguem-se separações gravimétricas (diferenças de densidade), [23][24][25] eletrostáticas e magnéticas. [26][27][28][29][30] A moagem tem como desvantagens a geração de finos, que podem implicar em perdas de componentes de alto valor agregado (como os metais nobres), além de exigir maiores cuidados com a higiene e saúde ocupacional no local de trabalho e o elevado consumo energético.…”

Section: Introductionunclassified

Processamento de placas de circuito impresso de equipamentos eletroeletrônicos de pequeno porte

et al. 2013

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Recebido em 31/5/12; aceito em 5/10/12; publicado na web em 18/2/13 PROCESSING OF PRINTED CIRCUIT BOARDS OF SMALL ELECTRICAL AND ELECTRONIC DEVICES. A hydrometallurgical process applicable to printed circuit boards of small electrical and electronic devices was developed. This involved three leaching steps (60 o C, 2 h): 6 mol L-1 NaOH, 6 mol L-1 HCl and aqua regia. NaOH removed the resin and flame retardant that covered the circuit boards. HCl dissolved the most electropositive metals and a small amount of copper (~0.3 wt%). Aqua regia dissolved the noble metals. Silver precipitated as AgCl. Gold and platinum were quantitatively extracted with pure methylisobutylketone and Alamine 336 (10 % vol. in kerosene), respectively. Slow evaporation of the raffinate crystallized CuCl 2 .4H 2 O (89% yield).

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Manufacturing process of reproduction plate by nonmetallic materials reclaimed from pulverized printed circuit boards

Cited by 16 publications

References 12 publications

Recycling of non-metallic fractions from waste printed circuit boards: A review

Recycling of non-metallic fractions from waste printed circuit boards: A review

Environmental Issues and Management Strategies for Waste Electronic and Electrical Equipment

Processamento de placas de circuito impresso de equipamentos eletroeletrônicos de pequeno porte

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