Few-layer
(FL) transition-metal dichalcogenides have drawn attention for nanoelectronics
applications due to their improved mobility, owing to the partial
screening of charged impurities at the oxide interface. However, under
realistic operating conditions, dissipation leads to self-heating,
which is detrimental to electronic and thermal properties. We fabricated
a series of FL-WSe2 devices and measured their I–V characteristics, while their
temperatures were quantified by Raman thermometry and simulated from
first principles. Our tightly integrated electrothermal study shows
that Joule heating leads to a significant layer-dependent temperature
rise, which affects mobility and alters the flow of current through
the stack. This causes the temperatures in the top layers to increase
dramatically, degrading their mobility and causing the current to
reroute to the bottom of the FL stack where thermal conductance is
higher. We discover that this current rerouting phenomenon improves
heat removal because the current flows through layers closer to the
substrate, limiting the severity of self-heating and its impact on
carrier mobility. We also observe significant lateral heat removal
via the contacts because of longer thermal healing length in the top
layers and explore the optimum number of layers to maximize mobility
in FL devices. Our study will impact future device designs and lead
to further improvements in thermal management in van der Waals (vdW)-based
devices.