2013
DOI: 10.1371/journal.pone.0053307
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Mapping the Complex Morphology of Cell Interactions with Nanowire Substrates Using FIB-SEM

Abstract: Using high resolution focused ion beam scanning electron microscopy (FIB-SEM) we study the details of cell-nanostructure interactions using serial block face imaging. 3T3 Fibroblast cellular monolayers are cultured on flat glass as a control surface and on two types of nanostructured scaffold substrates made from silicon black (Nanograss) with low- and high nanowire density. After culturing for 72 hours the cells were fixed, heavy metal stained, embedded in resin, and processed with FIB-SEM block face imaging … Show more

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Cited by 65 publications
(73 citation statements)
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“…The larger vesicles are presumably engaged on compartmentalization function, whereas the smaller vesicles are used for the vesicular transport. 9,17,43 Besides, sporadically individual nanowires were seen trapped in the cytoplasm and not included in vesicular structures ( Figure 6). However, it must be stressed that the nanowires are never in contact with the nuclear envelope or inside the nucleus.…”
mentioning
confidence: 99%
“…The larger vesicles are presumably engaged on compartmentalization function, whereas the smaller vesicles are used for the vesicular transport. 9,17,43 Besides, sporadically individual nanowires were seen trapped in the cytoplasm and not included in vesicular structures ( Figure 6). However, it must be stressed that the nanowires are never in contact with the nuclear envelope or inside the nucleus.…”
mentioning
confidence: 99%
“…8b shows the lifting of two nanopillars by a fully spread cell; in both figures the protruded membrane wraps around the round nanopillar sidewalls, creating a larger contact area. Such nanopillarecell interactions can possibly be the cause of nanopillar uptake for small nanopillars seen previously in some studies [12,24,25].…”
Section: Cell Interactions With Palladium Nanopillar Arraysmentioning
confidence: 57%
“…SEM images of the embedded CNTs were obtained using low acceleration voltages (2–5 kV) and low beam currents (1.4–4 nA) to limit beam damage. Image stacks were processed either according to the tilted- or non-tilted milling approach as previously described [20], and subsequently post-processed in Amira.
Fig. 2Schematic of the milling geometries used.
…”
Section: Methodsmentioning
confidence: 99%