Mask CD relationship to temperature at the time backscatter is received

Zable, Harold; Kronmiller, Tom; Pearman, Ryan; Guthrie, Bill; Shirali, Nagesh; Masuda, Yukihiro; Kamikubo, Takashi; Nakayamada, Noriaki; Fujimura, Aki

doi:10.1117/12.2282030

Photomask Japan 2017: XXIV Symposium on Photomask and Next-Generation Lithography Mask Technology 2017

DOI: 10.1117/12.2282030

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Mask CD relationship to temperature at the time backscatter is received

Harold Zable¹,

Tom Kronmiller²,

Ryan Pearman³

et al.

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2024

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Thermal analysis with high accuracy of multi-beam mask fabrication

Zhang,

Dong,

Liu

et al. 2024

Journal of Vacuum Science &Amp; Technology B

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For a 7 nm technology node and beyond, multi-beam mask fabrication based on charged particles has attracted attention widely and shows great advantages in terms of throughput. However, the heating effect during mask writing is a serious problem and makes deformation error. To address this issue, an accurate analysis of heating with multi-beam writing is necessary. In this study, the thermal effects of electron beams on a mask during writing time (exposure time and nonexposure time) were simulated with a finite element numerical method. The variation in the temperature field with two writing paths (S-shaped and E-shaped) was analyzed. A comparative analysis of the mask’s deformation under different writing paths was conducted. Numerical research shows that the thermal analysis method in this study provides a guide for optimizing the process parameters of mask fabrication.

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Thermal analysis with high accuracy of multi-beam mask fabrication

Zhang,

Dong,

Liu

et al. 2024

Journal of Vacuum Science &Amp; Technology B

View full text Add to dashboard Cite

show abstract

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Mask CD relationship to temperature at the time backscatter is received

Cited by 1 publication

References 1 publication

Thermal analysis with high accuracy of multi-beam mask fabrication

Thermal analysis with high accuracy of multi-beam mask fabrication

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