Mask defect auto disposition based on aerial image in mask product

Chen, C. Y.; Tuo, Laurent C.; Yoo, Chun Sang; Pang, Liang; Peng, Danping; Sun, Jin

doi:10.1117/12.824292

Cited by 9 publications

(10 citation statements)

References 7 publications

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“…LAIPH AIA has been used in production at all TSMC EBO locations -one in Hsinchu, and two in Tainan [9]. Figures 7 show the pilot run results of LAIPH at TSMC.…”

Section: Figure 6 Laiph Aia Gui To Review the Defect Disposition Resultsmentioning

confidence: 98%

“…Because this procedure is so complicated and tedious, and considering TSMC's EMO output of more than 5000 masks per month, it is easy to see that the opportunity for operator error during this manual disposition is significant. In the new flow enabled by the Aerial Image Analyzer (AIA) application on Luminescent's Automated Image Processor Hub (LAIPH TM , pronounced "life") platform, the disposition of mask defects is fully automated [9]. actual software workflow is more complicated.…”

Section: Figure 3 a Typical Defect Disposition Flow On Aimsmentioning

confidence: 99%

“…Currently such analysis is performed by an operator, with some help from software. For example, Figure 3 shows the manual flow performed by operators at TSMC mask shop [9]. First, the defect location is obtained from the inspection system.…”

Section: Aerial Image Analyzer (Aia): Die-to-die Modementioning

confidence: 99%

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Computational lithography and inspection (CLI) and its applications in mask inspection, metrology, review, and repair

Pang

Peng

et al. 2010

SPIE Proceedings

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At the most advanced technology nodes, such as 32nm, 22nm, and beyond, aggressive OPC and Sub-Resolution Assist Features (SRAFs) on the mask are essential for accurate on-wafer imaging; mask patterns generated by Inverse Lithography Technology (ILT) and Source Mask Optimization (SMO) may also be necessary for production. However, their use results in significantly increased mask complexity, making mask defect disposition more challenging than ever. Computational Lithography and Inspection (CLI) have broad applications in mask inspection, metrology, review, and repair, and provide additional information to assist the operator in making accurate and efficient decisions on defect disposition. In this paper these applications of CLI in mask inspection, off-line review, metrology, and repair are presented and discussed.

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“…LAIPH AIA has been used in production at all TSMC EBO locations -one in Hsinchu, and two in Tainan [9]. Figures 7 show the pilot run results of LAIPH at TSMC.…”

Section: Figure 6 Laiph Aia Gui To Review the Defect Disposition Resultsmentioning

confidence: 98%

Section: Figure 3 a Typical Defect Disposition Flow On Aimsmentioning

confidence: 99%

See 1 more Smart Citation

Computational lithography and inspection (CLI) and its applications in mask inspection, metrology, review, and repair

Pang

Peng

et al. 2010

SPIE Proceedings

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show abstract

“…Because this procedure is so complicated and tedious, and considering TSMC's EMO output of more than 5000 masks per month, it is easy to see that the opportunity for operator error during this manual disposition is significant. In the new flow enabled by the Aerial Image Analyzer (AIA) application on Luminescent's Automated Image Processor Hub (LAIPH TM , pronounced "life") platform, the disposition of mask defects is fully automated [9]. Figure 4 shows the flowchart for both Die-to-Die (D2D) and Die-to-Database (D2DB) modes of AIA.…”

Section: Figure 3 a Typical Defect Disposition Flow On Aimsmentioning

confidence: 99%

Expanding the applications of computational lithography and inspection (CLI) in mask inspection, metrology, review, and repair

Pang

Peng

et al. 2011

SPIE Proceedings

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Mask manufacturers will be impacted by two significant technology requirements at 22nm and below: The first is more extensive use of resolution enhancement technologies (RET), such as OPC or Inverse Lithography Technology (ILT), and Source Mask Optimization (SMO); the second is EUV technology. Both will create difficulties for mask inspection, defect disposition, metrology, review, and repair. For example, the use of ILT and SMO significantly increases mask complexity, making mask defect disposition more challenging than ever. EUV actinic inspection and AIMS TM will not be available for at least a few years, which makes EUV defect inspection and disposition more difficult, particularly regarding multilayer defects. Computational Lithography and Inspection (CLI), which has broad applications in mask inspection, metrology, review, and repair, has become essential to fill this technology gap. In this paper, several such CLI applications are presented and discussed.

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“…This disposition involves automatically aligning defect and reference images, calculating thresholds based on reference aerial image and target design GDS when using variable threshold model, or applying physical resist model to calculate the final wafer contour, computing absolute and %CD change at the defective site, and then dispositioning the defects based on user-defined verification rules. Figure 12 shows how different topologies can be defined in order to apply different sensitivities not only to the current mask layer but also to the underlying and overlying mask layers [9]. In the defect auto classification module, the patterns are automatically classified into different topologies, such as smooth region, corners, end-to-end, and end-to-smooth regions.…”

Section: Automatic Mask Defect Disposition Based On Simulated Wafer CDmentioning

confidence: 99%

Computational inspection applied to a mask inspection system with advanced aerial imaging capability

et al. 2010

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Traditional patterned mask inspection has been off-wavelength. For the better part of the past 25years mask inspection systems never adhered to the wavelength of the exposure tools. While in the days of contact and proximity printing this was not a major issue, with the arrival of steppers and scanners and the slow migration from 436nm, 405nm, 365nm and 248nm to ultimately 193nm, on-wavelength inspection has become a necessity. At first there was the option with defect and printline review using an at-wavelength AIMS tool [Fig 1], but now the industry has moved towards Patterned Mask Inspection to be at-wavelength too. With ever decreasing wavelength, more and more materials have become opaque, and especially the 266/257nm inspection to 193nm printing wavelength has proven to be a reliability issue. The industry took a major step forward with the adoption of at-wavelength aerial inspection, a paradigm shift in mask inspection, as it uses a hardware emulation to parallel the scanner's true illumination settings [Fig 2]. The technology has found wide-spread acceptance by now, and 19xnm inspection is now the industry standard. Maskshop [outgoing] captive/ merchant 1 st path: -d2db -d2d +AIMS review [193nm] 2 nd path -contam/repair off-O: -488/ -365/257nm High Resolution Aerial image Profile cross-section plot: Red: defect, Blue: referenceFig 1: Traditional O mismatch in mask inspection Fig 2: Paradigm Shift: at-O inspection in aerial modeHowever, with the ever advancing technology nodes, such as 32nm and 22nm, aggressive OPC and Sub-Resolution Assist Features (SRAFs) are required. Their use results in significantly increased mask complexity, challenging mask defect dispositioning more than ever. To address these challenges in mask inspection and defect dispositioning, new mask inspection technologies have been developed that not only provide high resolution masks imaged at the same wavelength as the scanner, but that also provide aerial images by using both: software simulation and hardware emulation.

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Mask defect auto disposition based on aerial image in mask product

Cited by 9 publications

References 7 publications

Computational lithography and inspection (CLI) and its applications in mask inspection, metrology, review, and repair

Computational lithography and inspection (CLI) and its applications in mask inspection, metrology, review, and repair

Expanding the applications of computational lithography and inspection (CLI) in mask inspection, metrology, review, and repair

Computational inspection applied to a mask inspection system with advanced aerial imaging capability

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