Mask-Enabled Topography Contrast on Aluminum Surfaces

Abstract

Patterned solid surfaces with wettability contrast can enhance liquid transport for applications such as electronics thermal management, self-cleaning, and anti-icing. However, prior work has not explored easy and scalable blade-cut masking to impart topography patterned wettability contrast on aluminum (Al), even though Al surfaces are widely used for thermal applications. Here, we demonstrate mask-enabled topography contrast patterning and quantify the resulting accuracy of the topographic pattern resolution, spatial variations in surface roughness, wettability, drop size distribution during dropwise condensation, and thermal emissivity of patterned Al surfaces. The method uses blade-cut vinyl mask templates and a commercially available lacquer resin that serves as a polymer resist against etching. Programmable mask templates enable complex patterning of wettability and emissivity contrast with feature sizes down to ∼1.5 mm. As-fabricated patterned samples show a water contact angle (θ) contrast from <5°to 80°between etched and smooth zones, while patterned samples that are further coated with a hydrophobic promoter show θ contrast between 150°and 120°on etched and smooth zones, respectively. In addition to measuring this wettability contrast via contact angle goniometry, we use condensation visualization experiments to study the spatially controlled condensate morphologies and drop size distributions. These condensation studies demonstrate enhanced droplet shedding on the superhydrophobic regions of striped patterned surfaces compared to homogeneous superhydrophobic surfaces. Motivated by the role of thermal radiation in many phase change processes, we use infrared thermography to map topography-mediated thermal emissivity (ε) contrast between etched (ε ≈ 0.65) and smooth (ε ≈ 0.26) regions. Thus, our study provides a route for researchers to readily create complex and scalable topography-patterned Al surfaces for potential applications in vapor chamber thermal rectification, radiative cooling condensation heat transfer, and high-temperature Leidenfrost or film boiling processes.