2017
DOI: 10.1063/1.4977562
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Mask-free construction of three-dimensional silicon structures by dry etching assisted gray-scale femtosecond laser direct writing

Abstract: A mask-free micro/nano fabrication method is proposed for constructing arbitrary gradient height structures on silicon, combining gray-scale femtosecond laser direct writing (GS-FsLDW) with subsequent dry etching. Arbitrary two-dimensional patterns with a gradient concentration of oxygen atoms can be fabricated on the surface of undoped silicon wafer by FsLDW in air. After dry etching, various three-dimensional (3D) gradient height silicon structures are fabricated by controlling the laser power, scanning step… Show more

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Cited by 26 publications
(13 citation statements)
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“…The laser pulse energy was controlled by a gradient‐transmittance attenuator and the number of laser pulses was set by a mechanical shutter. After femtosecond laser modification, a modified region was formed around the micropits at the energy deposition locus with the formation of nanocracks, stress transformation of lattice, or change of chemical structure . Due to the nonlinear laser–matter interaction, femtosecond laser can modify almost any hard materials when laser pulse energy larger than the damage threshold of materials.…”
Section: Resultsmentioning
confidence: 99%
“…The laser pulse energy was controlled by a gradient‐transmittance attenuator and the number of laser pulses was set by a mechanical shutter. After femtosecond laser modification, a modified region was formed around the micropits at the energy deposition locus with the formation of nanocracks, stress transformation of lattice, or change of chemical structure . Due to the nonlinear laser–matter interaction, femtosecond laser can modify almost any hard materials when laser pulse energy larger than the damage threshold of materials.…”
Section: Resultsmentioning
confidence: 99%
“…Then, 3D microstructures can be fabricated on silicon wafer after suitable dry etching conditions. Based on this principle, Liu et al 104 verified the feasibility of the dry-etching-assisted femtosecond laser gray-scale modification technology by successful fabrication of complex 3D microstructures on silicon wafer. For example, the 2D Fresnel zone plate pattern (Fig.…”
Section: Dry-etching-assisted Femtosecond Laser Modificationmentioning
confidence: 99%
“…As the ratio of etching rate between silicon and silica is about 10:1 when etched by fluorine-based gas 102,103 , the laser modified pattern can be used as the mask for 3D microstructures transferring 63 . More interestingly, the ability of etching resistant of laser modified region is greatly related to the concentration of oxygen atoms which can be adjusted by laser parameters 104 . Therefore, gray-scale 2D patterns with a concentration of oxygen atoms change with in-site position by femtosecond laser modification.…”
Section: Dry-etching-assisted Femtosecond Laser Modificationmentioning
confidence: 99%
“…Similar to FLWE, the microfabrication of MLAs by femtosecond laser dry etching (FLDE) technique also consists of two steps. [133,134] Liu et al fabricated microlenses with controllable diameter and sag height by this method. [25] As shown in Figure 9c, the silicon substrate was irradiated by the focused laser beam to form an array of ablated craters.…”
Section: Femtosecond Laser Wet Etching Technique (Flwe) Techniquementioning
confidence: 99%