Mask-Less Electrochemical Additive Manufacturing: A Feasibility Study

Sundaram, Murali; Kamaraj, Abishek B.; Kumar, Varun S

doi:10.1115/1.4029022

Cited by 61 publications

(20 citation statements)

References 32 publications

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“…The optics design for the system is presented by the authors in ref. 28 and using this setup, an area of 2.3 mm by 1.3 mm can be patterned at once with a feature resolution of 1.2 μm which is close to the desired resolution. The optics are selected ensuring that the diffraction limited resolution of the focusing optics is smaller than the desired 1 μm pixel resolution.…”

Section: Laser Sintering <5 μM Features With High Throughputmentioning

confidence: 95%

“…electrohydrodynamic jet printing and direct ink writing cannot produce the types of true 3D structures with overhangs that will be required for the next generation of 3D electronics [25][26][27] , and other processes such as electrochemical deposition and Laser Chemical Vapor deposition are too slow to be used in high volume production environments 28,29 . Overall, none of the existing microscale AM processes is capable of generating the types of true 3D metal structures with feature resolutions of less than 5 μm and volumetric throughputs greater than 50 mm 3 /hour that are required for the production-scale, microelectronics packaging environment.…”

Section: Introductionmentioning

confidence: 99%

“…Figure 2 shows a schematic of the μ-SLS system. The system consists of three major sub-systems: (1) a particle bed formation (spreader) setup which is used to generate the sub-μm particle bed, (2) an optical setup which is comprised of laser system and optics designed to achieve the sintering resolution and high throughput 28 , and (3) a sample transfer, alignment, and metrology setup used to shuttle the particle bed between optical and spreader subsystems with resolution of better than 10 nm. In addition, a vacuum chuck is used to hold the substrate in place and ensure that it does not deform during the coating or writing processes.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

A novel microscale selective laser sintering (μ-SLS) process for the fabrication of microelectronic parts

et al. 2019

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One of the biggest challenges in microscale additive manufacturing is the production of three-dimensional, microscale metal parts with a high enough throughput to be relevant for commercial applications. This paper presents a new microscale additive manufacturing process called microscale selective laser sintering (μ-SLS) that can produce true 3D metal parts with sub-5 μm resolution and a throughput of greater than 60 mm 3 /hour. In μ-SLS, a layer of metal nanoparticle ink is first coated onto a substrate using a slot die coating system. The ink is then dried to produce a uniform nanoparticle layer. Next, the substrate is precisely positioned under an optical subsystem using a set of coarse and fine nanopositioning stages. In the optical subsystem, laser light that has been patterned using a digital micromirror array is used to heat and sinter the nanoparticles into the desired patterns. This set of steps is then repeated to build up each layer of the 3D part in the μ-SLS system. Overall, this new technology offers the potential to overcome many of the current limitations in microscale additive manufacturing of metals and become an important process in microelectronics packaging applications.

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Section: Laser Sintering <5 μM Features With High Throughputmentioning

confidence: 95%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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A novel microscale selective laser sintering (μ-SLS) process for the fabrication of microelectronic parts

et al. 2019

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“…A specific branch of research is dedicated to the optimisation of tool generation path including studies related to the improvement of the scanning mode [93,94], geometry slicing strategies [95,96], optimal material deposition [97,98], multi-directional AM [99], tool path anticipation procedures [100]. -Process selection: different technologies are developed to enhance the capabilities of AM like jet printing [26,101], friction stir AM [102], welding based AM [94], ultrasonic AM [103], electrochemical AM [104], micro-plasma powder deposition [105], Solid freeform fabrication [106] and related variants such as selective laser sintering [107,108], or directed light fabrication [20], selective infiltration manufacturing [109]). The outcomes of these technologies diverge.…”

Section: Optimisation In Additive Manufacturingmentioning

confidence: 99%

Challenges of additive manufacturing technologies from an optimisation perspective

Guessasma

Zhang

Zhu

et al. 2015

Int. J. Simul. Multisci. Des. Optim.

100

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-Three-dimensional printing offers varied possibilities of design that can be bridged to optimisation tools. In this review paper, a critical opinion on optimal design is delivered to show limits, benefits and ways of improvement in additive manufacturing. This review emphasises on design constrains related to additive manufacturing and differences that may appear between virtual and real design. These differences are explored based on 3D imaging techniques that are intended to show defect related processing. Guidelines of safe use of the term ''optimal design'' are derived based on 3D structural information.

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“…[20][21][22] Another so-called local electrochemical deposition was invented relying on a locally positioned anode. [12][13][14] Such an anode is typically surrounded by a large insulating material and is closely positioned in a vicinity of the cathode substrate, [23][24][25][26] creating a highly local electrical field that enables the deposition to occur only at the location closest to the anode. Recently, Hirt et al 27 used a modified atomic force microscope tip with fluidic channel to introduce metal electrolyte and demonstrated a controllable growth process for the local growth of 3D structures.…”

mentioning

confidence: 99%

Electrochemical Formation of Free-Standing 3D Structures Using Injection of Additives

Huang

Gyorgak

Pak

2017

J. Electrochem. Soc.

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A new method of electrochemical formation of free-standing 3D structures based on the injection of additives that controls the deposition rate was demonstrated using copper-chloride-polyethylene glycol as an example. A densely-packed defect-free pillar was formed upon the injection of chloride-free electrolyte into a chloride-containing electrolyte, where copper deposition was fully suppressed. The effects of diffusion coefficient, injection rate and the distance between injection nozzle and pillar top were evaluated with numerical simulation. A fast diffusion species, a moderate injection rate and a small gap between injection and pillar were found beneficial to obtaining the best contrast in the growth rates between pillar and background. The demonstration of free-standing copper structure in this paper provides an alternative path for electrochemical 3D printing of various metallic materials. Free-standing metallic structures are of interest for various devices. The recently developed additive manufacturing enables the direct formation of such structures without the need of expensive lithography processes.1 Among them, the metal wire feed process 2 was directly adapted from the original extrusion version of polymer 3D printing. 3-5 Extrusion and sintering of metal paste 6 also allow the formation of metal structures. Selective laser melting or sintering [7][8][9] of metal particles can create free-standing or non-attached metallic structures embedded in metal powders.While most of the above processes were heat-based physical processes, chemical reaction based 3D printing processes have been developed typically for direct formation of smaller structures. Tip based electrochemical machining has been widely used in the past to subtractively machine metallic or non-metallic structures for microdevices.10,11 However, electrochemical deposition processes have not been used until more recently for additive formation of 3D metal [12][13][14][15] and conductive polymer [16][17][18] micro-structures. Metal electrodeposition typically involves the reduction of metal ions into metal atoms on a conductive substrate. Therefore, 3D electrodeposition methods taking advantage of a local electrical field, local metal ion or local conductive substrate have been developed. The traditional lithography based electroforming, for example, the through-mask plating and LIGA process are based on the local exposure of conductive substrate. 19 This through mask concept has also been extended to achieve direct formation of nanostructures through local deposition. [20][21][22] Another so-called local electrochemical deposition was invented relying on a locally positioned anode.12-14 Such an anode is typically surrounded by a large insulating material and is closely positioned in a vicinity of the cathode substrate, 23-26 creating a highly local electrical field that enables the deposition to occur only at the location closest to the anode. Recently, Hirt et al. 27 used a modified atomic force microscope tip with fluidic channel to introduc...

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Mask-Less Electrochemical Additive Manufacturing: A Feasibility Study

Cited by 61 publications

References 32 publications

A novel microscale selective laser sintering (μ-SLS) process for the fabrication of microelectronic parts

A novel microscale selective laser sintering (μ-SLS) process for the fabrication of microelectronic parts

Challenges of additive manufacturing technologies from an optimisation perspective

Electrochemical Formation of Free-Standing 3D Structures Using Injection of Additives

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