2002
DOI: 10.1088/0963-0252/11/4/306
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Mass spectrometric measurements in inductively coupled CF4/Ar plasmas

Abstract: Positive ion fluxes, mean ion energies and ion energy distribution functions in low pressure CF 4 /Ar plasmas have been measured. The experiments were conducted in a Gaseous Electronics Conference cell using an inductively coupled plasma device powered by a 13.56 MHz radiofrequency (rf) power source. The measurements were made at 200 and 300 W of input rf power and at 10, 20, 30 and 50 mTorr gas pressures for three gas mixtures: (i) 20% CF 4 : 80% Ar, (ii) 50% CF 4 : 50% Ar and (iii) 80% CF 4 : 20% Ar. A Langm… Show more

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Cited by 16 publications
(17 citation statements)
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“…of quartz window were also detected by Rao et al [30,31] and Zhou et al [32] Hikosaka et al [33] used a quadrupole mass spectrometer (QMS) to measure gas composition in a highpower CF 4 discharge. CO and SiF 3 were found due to the etching of quartz (SiO 2 ) window, which significantly deteriorated the etching selectivity of SiO 2 in an ICP reactor.…”
Section: Introductionmentioning
confidence: 94%
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“…of quartz window were also detected by Rao et al [30,31] and Zhou et al [32] Hikosaka et al [33] used a quadrupole mass spectrometer (QMS) to measure gas composition in a highpower CF 4 discharge. CO and SiF 3 were found due to the etching of quartz (SiO 2 ) window, which significantly deteriorated the etching selectivity of SiO 2 in an ICP reactor.…”
Section: Introductionmentioning
confidence: 94%
“…Results show that these species concentrated in the central core region due to electron related ionization from feedstock gas CF 4 (F01$F10) with CF 3 which is similar to those observed by some experiments. [30,41] In addition, the CF 3 þ concentration not only peaks in the central core region but also in the region near gas inlet because of its low threshold energy of dissociative ionization (14.8 eV). Figure 11 shows the spatial distributions of the concentrations of oxygencontaining positive charged species, including O þ , O 2 þ , and CO þ .…”
Section: à3mentioning
confidence: 99%
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“…From the applied point of view, knowledge of both the product fractional abundance and the reaction rate coecient is fundamental for the modeling and optimization of plasmas for industrial applications [7]. CF 4 is a commonly used gas in radiofrequency (rf) plasmas for etching SiO 2 (typically, mixtures of uorocarbons and argon are used in plasma etching), depositing silicon oxide and silicon nitride layers and for plasma chamber cleaning processes [1,1317].…”
Section: Introductionmentioning
confidence: 99%
“…This is the reason why we chose CF 4 as an investigation gas to understand the influence of power and frequency levels on IEDs. CF + 3 is found as the major ionic species in the discharge [38]; however, other fluorocarbon ions (CF + 2 , CF + ) are also present in significant number. The main mechanism responsible for the production of fluorocarbons is the direct electron impact ionization of the parent molecule (CF 4 ), and it produces fluorocarbons in the order CF + 3 > CF + 2 > CF + .…”
Section: Introductionmentioning
confidence: 99%