Material Characterization of High Dielectric Constant Polymer–CeramicComposite for Embedded Capacitor to RF Application

Abstract

Embedded capacitor technology can improve electrical performance and reduce assembly cost compared with traditional discrete capacitor technology. Polymer–ceramic composites have been of great interest as embedded capacitor material because they combine the processability of polymers with the desired electrical properties of ceramics. A novel nano-structure polymer–ceramic composite with very high dielectric constant (εr∼150, a new record for the highest reportedεrvalue of nano-composite) has been developed in our previous work. RF application of embedded capacitors requires that insulating material have high dielectric constant at high frequency (GHz), low leakage current, high breakdown voltage and high reliability. A set of electrical tests have been conducted in this work to characterize the properties of the in house developed novel high dielectric constant polymer–ceramic nano-composite. Results show that this material has faily high dielectric constant in the RF range, low electrical leakage and high breakdown voltage. 85/85 TH aging test has been performed and it had shown this novel high K material has good reliability. An embedded capacitor prototype with capacitance density of35 nF/cm2has been manufactured using this nano-composite with spinning coating technology. This novel nano-composite can be used for the integral capacitors in the RF applications.

Effect of Zn filler for percolative BaTiO3/Zn composite films fabricated by aerosol deposition

“…Among the passive elements, the capacitor is a widely used and very important element, and composite capacitors, such as metal-ceramic and polymer-ceramic have been developed using the percolation method, to fabricate capacitors of high-capacity [5][6][7][8]. However, during the capacitor fabrication process, the high sintering temperature (Z 250 1C) of ceramic materials causes several problems, because the printed wiring board (PWB) often used as a substrate in the electric device is easily transformed by heat [2]. In order to solve this problem, percolative capacitors using an aerosol deposition (AD) process have been introduced, because the AD process fabricates metal-ceramic percolative capacitors at room temperature, and they can be embedded in circuit board in film form [7].…”

“…The SOP provides system functions within a package to various electric elements (such as digital IC, analog IC, RF IC, and passive element). Thus, the passive elements that comprise 80% of electronic products are embedded in board in film form, and active elements are stacked above board [2,4,5]. The miniaturization of electronic product would be possible through the result of SOP.…”

“…In order to develop such high performance electronic products, the inner parts of electronic products have been studied to develop a new structure [1]. By means of the suggested 3-dimensional stacking method of the system on package (SOP), the electronic product is expected to offer improved electric characteristics, low-cost, simple process, miniaturization and increased operating frequency [2,3]. The SOP provides system functions within a package to various electric elements (such as digital IC, analog IC, RF IC, and passive element).…”

Effects of moisture absorption on the electrical parameters of embedded capacitors with epoxy-BaTiO3 nanocomposite dielectric

“…These passive components consist of capacitors, resistors, and inductors. In a typical PWB, such as one in a cell phone, about 80% of the board is occupied by these passive components [1], and most of these passive components are capacitors [2]. The component density due to these capacitors is increasing due to increasing demands in telecommunication, computer, automotive, and consumer sectors.…”

High dielectric constant polyaniline/sulfonated poly(aryl ether ketone) composite membranes with good thermal and mechanical properties

“…[1][2][3][4] Recently, all-organic, high-dielectric-constant and low-dielectricloss polymeric films have been widely investigated in the fabrication of embedded passives for their mechanical flexibility, low-temperature processability, and good process compatibility with printed circuit boards. 5,6 Among these polymeric films, conductive filler/polymer composites have gained special attention because they show a dramatic increase in their dielectric constants close to the percolation threshold. Until now, various metal fillers, such as silver, aluminum, and nickel, have been used to prepare metal/polymer composites or three-phase percolative composite films.…”