Material embrittlement in high strain-rate loading

Yang, Xiuxuan; Zhang, Bi

doi:10.1088/2631-7990/ab263f

Cited by 63 publications

(19 citation statements)

References 124 publications

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“…For impact loading at a lower strain rate, the stress or strain threshold is higher, while at a higher strain rate, it become slower. In other words, the brain tissue, like other materials, may become more brittle at a higher strain rate ( Yang and Zhang, 2019 ). This is probably because micromechanically, there is not enough time for dispersion of the linear momentum into other regions of the brain, and the localized deformation is manifested through skull indentation and coup injury.…”

Section: Discussionmentioning

confidence: 99%

A Methodology to Compare Biomechanical Simulations With Clinical Brain Imaging Analysis Utilizing Two Blunt Impact Cases

Tan

Sajja

D’Souza

et al. 2021

Front. Bioeng. Biotechnol.

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According to the US Defense and Veterans Brain Injury Center (DVBIC) and Centers for Disease Control and Prevention (CDC), mild traumatic brain injury (mTBI) is a common form of head injury. Medical imaging data provides clinical insight into tissue damage/injury and injury severity, and helps medical diagnosis. Computational modeling and simulation can predict the biomechanical characteristics of such injury, and are useful for development of protective equipment. Integration of techniques from computational biomechanics with medical data assessment modalities (e.g., magnetic resonance imaging or MRI) has not yet been used to predict injury, support early medical diagnosis, or assess effectiveness of personal protective equipment. This paper presents a methodology to map computational simulations with clinical data for interpreting blunt impact TBI utilizing two clinically different head injury case studies. MRI modalities, such as T1, T2, diffusion-weighted imaging (DWI) and apparent diffusion coefficient (ADC), were used for simulation comparisons. The two clinical cases have been reconstructed using finite element analysis to predict head biomechanics based on medical reports documented by a clinician. The findings are mapped to simulation results using image-based clinical analyses of head impact injuries, and modalities that could capture simulation results have been identified. In case 1, the MRI results showed lesions in the brain with skull indentation, while case 2 had lesions in both coup and contrecoup sides with no skull deformation. Simulation data analyses show that different biomechanical measures and thresholds are needed to explain different blunt impact injury modalities; specifically, strain rate threshold corresponds well with brain injury with skull indentation, while minimum pressure threshold corresponds well with coup–contrecoup injury; and DWI has been found to be the most appropriate modality for MRI data interpretation. As the findings from these two cases are substantiated with additional clinical studies, this methodology can be broadly applied as a tool to support injury assessment in head trauma events and to improve countermeasures (e.g., diagnostics and protective equipment design) to mitigate these injuries.

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Section: Discussionmentioning

confidence: 99%

A Methodology to Compare Biomechanical Simulations With Clinical Brain Imaging Analysis Utilizing Two Blunt Impact Cases

Tan

Sajja

D’Souza

et al. 2021

Front. Bioeng. Biotechnol.

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“…The second, a number of researchers reported other theoretical perspectives compared with ductile regime grinding. Yang and Zhang [43] suggested that during ultrasonically assisted machining, the higher speed and acceleration led to a high strain rate, which might evoke material embrittlement in the machining process. Accordingly, the material resistance ahead of the crack tip increased with the strain-rate and impeded crack propagation as shown in Fig.…”

Section: Discussion On Ultrasonic Vibration Effectmentioning

confidence: 99%

Experimental studies on material removal mechanisms in ultrasonic assisted grinding of SiC ceramics with a defined grain distribution brazed grinding wheel

Ding

Zhang

2021

Int J Adv Manuf Technol

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Ultrasonic assisted grinding (UAG) is one of the most suitable methods for the processing of hard and brittle materials such as silicon carbide (SiC). During UAG of SiC, the machining quality is directly determined by the material removal mechanism. However, the research on the material removal mechanism for UAG of SiC is still not sufficiently developed. To achieve better comprehension of the material removal mechanism in UAG of SiC, this study conducted both UAG and conventional grinding (CG) tests with a brazed grinding wheel with defined grain distribution. The material removal mechanism in UAG of SiC was studied by comparing the ground surface/subsurface micro-morphology, surface roughness, grinding force, and specific grinding energy between both processes. The results showed that the material removal mechanism experienced a transition from ductile removal to brittle fracture with increasing undeformed chip thickness in both UAG and CG. In addition, the ground surface roughness, grinding force, and subsurface breakage size increased with increasing undeformed chip thickness, while the specific grinding energy first decreased rapidly and then stabilised. Compared with conventional grinding, UAG always resulted in lower surface/subsurface breakage, surface roughness grinding force, and specific grinding energy under identical operating conditions.

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“…In addition, the current contact constitutive model in DEM simulation basically only considers the mechanical response of the material under static or quasi-static (including the calibration process). But in the processing of hard-brittle materials, the strain rate of the material is usually up to 10 2 -10 7 s -1 [202]. Therefore, how to improve the constitutive model of the material and calibrate its dynamic response through experiments such as Split Hopkins Pressure Bar (SHPB) [203] may be a direction worth studying in the future of DEM numerical simulation processing of hard-brittle materials.…”

Section: Selection and Improvement Of Materials Constitutive Modelmentioning

confidence: 99%

Discrete element modeling of the machining processes of brittle materials: recent development and future prospective

Jiang

Tang

et al. 2020

Int J Adv Manuf Technol

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In recent years, the discrete element method (DEM) has been used to model the bulk material, especially for the brittle materials (such as rocks, ceramics, concrete, ice, etc.) with various mechanical properties or responses by setting serials of contact properties (such as bonds) in the particle assembly. These bonds can withstand a certain amount of force and/or moment, so that the stresses executed in the bond can be used for determining the initiation and propagation of micro-crack. There are increasing evidences over the last twenty years that the DEM is becoming an effective numerical method to simulate the cracking, crushing and deformation of continuous media under external loads. The DEM has now been widely used in the field of processing and machining of rock, ceramic, concrete and other brittle materials. In this paper, the theoretical principles, formulations, contact models as well as the numerical solving processes of DEM are introduced. The applications of DEM for the machining processes of brittle and rigid materials such as ceramics are described and reviewed in detail, with future development trend also discussed.

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Material embrittlement in high strain-rate loading

Cited by 63 publications

References 124 publications

A Methodology to Compare Biomechanical Simulations With Clinical Brain Imaging Analysis Utilizing Two Blunt Impact Cases

A Methodology to Compare Biomechanical Simulations With Clinical Brain Imaging Analysis Utilizing Two Blunt Impact Cases

Experimental studies on material removal mechanisms in ultrasonic assisted grinding of SiC ceramics with a defined grain distribution brazed grinding wheel

Discrete element modeling of the machining processes of brittle materials: recent development and future prospective

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