Material extrusion additive manufacturing and experimental testing of topology-optimised passive heat sinks using a thermally-conductive plastic filament

Huttunen, Eetu; Nykänen, Mikko T.; Alexandersen, Joe

doi:10.1016/j.addma.2022.103123

Cited by 3 publications

(1 citation statement)

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“…With this material, they 3D-printed heat sinks, demonstrating enhanced thermal dissipation. In 2022, Huttunen et al [49] focused on heat sink topology optimization exploiting FDM flexibility in producing complex geometries, using a commercial polyamide-based composite. However, to the best of our knowledge, the development of thermally conductive and electrically insulating polymer-based FDM 3D-printed heat sinks has been rarely investigated.…”

Section: Introductionmentioning

confidence: 99%

Thermally Conductive and Electrically Insulating Polymer-Based Composites Heat Sinks Fabricated by Fusion Deposition Modeling

Bagatella,

Cereti,

Manarini

et al. 2024

Polymers

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This study explores the potential of novel boron nitride (BN) microplatelet composites with combined thermal conduction and electrical insulation properties. These composites are manufactured through Fusion Deposition Modeling (FDM), and their application for thermal management in electronic devices is demonstrated. The primary focus of this work is, therefore, the investigation of the thermoplastic composite properties to show the 3D printing of lightweight polymeric heat sinks with remarkable thermal performance. By comparing various microfillers, including BN and MgO particles, their effects on material properties and alignment within the polymer matrix during filament fabrication and FDM processing are analyzed. The characterization includes the evaluation of morphology, thermal conductivity, and mechanical and electrical properties. Particularly, a composite with 32 wt% of BN microplatelets shows an in-plane thermal conductivity of 1.97 W m−1 K−1, offering electrical insulation and excellent printability. To assess practical applications, lightweight pin fin heat sinks using these composites are designed and 3D printed. Their thermal performance is evaluated via thermography under different heating conditions. The findings are very promising for an efficient and cost-effective fabrication of thermal devices, which can be obtained through extrusion-based Additive Manufacturing (AM), such as FDM, and exploited as enhanced thermal management solutions in electronic devices.

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Section: Introductionmentioning

confidence: 99%