2021
DOI: 10.1002/adem.202100343
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Material Flow Behavior and Microstructure Evolution During Direct Hot‐Press Bonding of Ti/Mg Laminates with Interlocking Structure

Abstract: With widespread applications of electronic devices, the injuries by the complex electromagnetic environment to the electronic device industry and human health are of extensive concern, and this also promotes the exploitation of electromagneticshielding and absorbing materials. In recent years, a kind of new composite material based on the carbon framework and oxide nanoparticles exhibits excellence in the aspect of electromagnetic absorbing. [1][2][3][4] However, its formability and mechanical properties need … Show more

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“…However, this process can last for several hours, severely limiting the efficiency of the method. [42,43] In contrast, direct hot pressing is much more efficient because it simplifies the process. The interfacial bonding is achieved with large load pressurization under atmospheric conditions.…”
Section: Hot Pressingmentioning
confidence: 99%
“…However, this process can last for several hours, severely limiting the efficiency of the method. [42,43] In contrast, direct hot pressing is much more efficient because it simplifies the process. The interfacial bonding is achieved with large load pressurization under atmospheric conditions.…”
Section: Hot Pressingmentioning
confidence: 99%