Material removal energy in ultraprecision machining of micro-lens arrays on single crystal silicon by slow tool servo

Zhao, Ze; Yin, Tengfei; To, Suet; Zhu, Zhiwei; Zhuang, Zhuoxuan

doi:10.1016/j.jclepro.2021.130295

Cited by 17 publications

(1 citation statement)

References 35 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The fabrication processes of microlens arrays include ultra-precision machining technologies [11][12][13][14][15], laser direct writing [16][17][18], grayscale lithography [19,20], nanoimprint lithography [21][22][23][24], and thermal reflow processes [25][26][27][28]. Ultra-precision machining technologies, such as single point diamond turning (SPDT), are capable of fabricating microstructures with complex morphology and excellent precision.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of Large-Area Silicon Spherical Microlens Arrays by Thermal Reflow and ICP Etching

Wu,

Dong,

Wang

et al. 2024

Micromachines

View full text Add to dashboard Cite

In this paper, we proposed an efficient and high-precision process for fabricating large-area microlens arrays using thermal reflow combined with ICP etching. When the temperature rises above the glass transition temperature, the polymer cylinder will reflow into a smooth hemisphere due to the surface tension effect. The dimensional differences generated after reflow can be corrected using etching selectivity in the following ICP etching process, which transfers the microstructure on the photoresist to the substrate. The volume variation before and after reflow, as well as the effect of etching selectivity using process parameters, such as RF power and gas flow, were explored. Due to the surface tension effect and the simultaneous molding of all microlens units, machining a 3.84 × 3.84 mm2 silicon microlens array required only 3 min of reflow and 15 min of ICP etching with an extremely low average surface roughness Sa of 1.2 nm.

show abstract

Section: Introductionmentioning

confidence: 99%

Fabrication of Large-Area Silicon Spherical Microlens Arrays by Thermal Reflow and ICP Etching

Wu,

Dong,

Wang

et al. 2024

Micromachines

View full text Add to dashboard Cite

show abstract

Dielectric‐Based Metamaterials for Near‐Perfect Light Absorption

Wang,

Qin,

Duan

et al. 2024

Adv Funct Materials

View full text Add to dashboard Cite

The emergence of metamaterials and their continued prosperity have built a powerful working platform for accurately manipulating the behavior of electromagnetic waves, providing sufficient possibility for the realization of metamaterial absorbers with outstanding performance. However, metamaterial absorbers composed of metallic materials typically possess many unfavorable factors, such as non‐adjustable absorption, easy oxidation, low‐melting, and expensive preparation costs. The selection of dielectric materials provides excellent alternatives due to their remarkable properties, thus dielectric‐based metamaterial absorbers (DBMAs) have attracted much attention. To promote breakthroughs in DBMAs and guide their future development, this work systematically and deeply reviews the recent research progress of DBMAs from four different but progressive aspects, including physical principles; classifications, material selections and tunable properties; preparation technologies; and functional applications. Five different types of theories and related physical mechanisms, such as Mie resonance, guided‐mode resonance, and Anapole resonance, are briefly outlined to explain DBMAs having near‐perfect absorption performance. Mainstream material selections, structure designs, and different types of tunable DBMAs are highlighted. Several widely utilized preparation methods for customizing DBMAs are given. Various practical applications of DBMAs in sensing, stealth technology, solar energy absorption, and electromagnetic interference suppression are reviewed. Finally, some key challenges and feasible solutions for DBMAs’ future development are provided.

show abstract

Modeling and experiment of material removal rate for cutting single-crystal silicon by electrical discharge wire sawing

Jia,

Li,

Shao

et al. 2024

Int J Adv Manuf Technol

View full text Add to dashboard Cite

Material removal energy in ultraprecision machining of micro-lens arrays on single crystal silicon by slow tool servo

Cited by 17 publications

References 35 publications

Fabrication of Large-Area Silicon Spherical Microlens Arrays by Thermal Reflow and ICP Etching

Fabrication of Large-Area Silicon Spherical Microlens Arrays by Thermal Reflow and ICP Etching

Dielectric‐Based Metamaterials for Near‐Perfect Light Absorption

Modeling and experiment of material removal rate for cutting single-crystal silicon by electrical discharge wire sawing

Contact Info

Product

Resources

About